K. Courouble, L. Broussous, S. Zoll, K. Haxaire, M. Mellier, G. Druais
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引用次数: 0
Abstract
In this paper, wet cleaning solution compatible with cobalt are investigated to achieve low Co etching rate on blankets film and no film attack on patterned 14nm wafer after line and via etching. Proposed solutions are compared to conventional wet cleaning solutions.
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