Depletion-mode MOS capacitor modeling investigation

C. Tseng, Yuan Sheng Wang
{"title":"Depletion-mode MOS capacitor modeling investigation","authors":"C. Tseng, Yuan Sheng Wang","doi":"10.1109/CSTIC.2017.7919748","DOIUrl":null,"url":null,"abstract":"A depletion-mode MOS (DMOS) capacitor modeling methodology with high accuracy and feasibility is proposed. Currently, it is lack of compact model relevant DMOS capacitor modeling but it is significant importance in A/D converters (ADCs) for CMOS image sensor circuit. This modeling methodology not only could provide good accuracy on geometry scaling but also with voltage and temperature sensitivity.","PeriodicalId":6846,"journal":{"name":"2017 China Semiconductor Technology International Conference (CSTIC)","volume":"44 9 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2017-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 China Semiconductor Technology International Conference (CSTIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSTIC.2017.7919748","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

A depletion-mode MOS (DMOS) capacitor modeling methodology with high accuracy and feasibility is proposed. Currently, it is lack of compact model relevant DMOS capacitor modeling but it is significant importance in A/D converters (ADCs) for CMOS image sensor circuit. This modeling methodology not only could provide good accuracy on geometry scaling but also with voltage and temperature sensitivity.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
耗尽模式MOS电容建模研究
提出了一种高精度、可行性高的耗尽模式MOS (DMOS)电容建模方法。目前,缺乏与DMOS电容相关的紧凑模型建模,但它在CMOS图像传感器电路的A/D转换器(adc)中具有重要意义。这种建模方法不仅可以提供良好的几何缩放精度,而且具有电压和温度敏感性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Wafer size MOS2 with few monolayer synthesized by H2S sulfurization A fast and low-cost TSV/TGV filling method Finger print sensor molding thickness none destructive measurement with Terahertz technology Research of SMO process to improve the imaging capability of lithography system for 28nm node and beyond The study on the moldability and reliability of epoxy molding compound
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1