Analysis of multilayer and multifunctional circuit in processor

Abstract

The manufacturer facing the lot of problem the components are several stage to check and final assembling a device. This case BTS chipset can be a daunting task. Sometimes critical challenge is verifying product performance prior to delivery to the customer. An emerging trends need to testing often more time. The testing time is directly related to cost something that manufacturers are continually looking to reduce with automatic test equipment (ATE). In case the wafer fabrication generally refers to the process of building integrated circuits on silicon wafers. Former to wafer fabrication, the raw silicon wafers to be used for this purpose are first produced from very pure silicon ingots. The wafer etching processing period to involve sensor material include in chip method ie., embedded device, interconnect density of conducting material ,residual error minimized and verified.