S. Beer, H. Gulan, M. Pauli, C. Rusch, G. Kunkel, T. Zwick
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引用次数: 19
Abstract
This paper presents a 122-GHz chip-to-antenna wire bond interconnect for low-cost, fully integrated transceivers. It is based on the standard ball-stitch bond technology and uses planar transmission lines for matching. A study on the effects of process tolerances is given. Finally, an antenna which is integrated into a QFN plastic package is characterized together with the chip-to-antenna interconnect.
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