Silicon substrate strength enhancement depending on nanostructure morphology

Abstract

Silicon nanostructures are extensively being researched for many different applications for industries. Here we present two different types of nanostructures, silicon nanoplates and nanoholes fabricated by electroless metal assisted wet etching for enhancing the bending strength by ~3.7 fold and ~6 fold respectively as compared to polished silicon samples which emphasize the dependence of bending strength on nanostructure morphologies. Roughness at the nanostructure bottom cause stress concentration to increase which degrades the bending strength. Moreover, this technology can open a pathway of flexible silicon substrates for flexible and bendable electronics.