Development of elastic polishing materials for the process of chemical-mechanical planarization

D. I. Terashkevich, E. S. Bokova, G. Kovalenko
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Abstract

The paper presents the results of the development of conditions for the production of elastic polishing materials based on solutions of polyethyruretanes, for the chemical-mechanical planarization of semiconductor silicon wafers.
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化学-机械刨平工艺用弹性抛光材料的研制
本文介绍了以聚脲烷溶液为基础的用于半导体硅片化学-机械平面化的弹性抛光材料生产条件的发展结果。
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