Application of three-dimensional X-ray microscopy in failure analysis for plastic encapsulated microelectronics

Abstract

Plastic encapsulated microelectronics (PEMs) is widely used because of its smaller size, lower cost and lighter weight. Nowadays, the reliability and failure analysis of PEMs become the focus. However, the location of failure is a difficulty. In this paper, the principle of three-dimensional (3D) X-ray microscopy as a non-destructive method would be introduced and the common failure modes of PEMs would be summarized. Moreover, the application of 3D X-ray microscopy in failure analysis for PEMs would be presented. The internal structure of PEMs could be reconstructed by 3D X-ray microscopy. The type of failure could be distinguished by this non-destructive method. Compared to 2D X-ray, the defects of PEMs could be located in three-dimensional space by means of 3D X-ray microscopy.