Effect of hydrodynamic and thermal slip on droplet based thermal management systems

J. Thalakkottor, K. Mohseni
{"title":"Effect of hydrodynamic and thermal slip on droplet based thermal management systems","authors":"J. Thalakkottor, K. Mohseni","doi":"10.1109/ITHERM.2014.6892306","DOIUrl":null,"url":null,"abstract":"Fluid flow in a microchannel is primarily laminar due to viscous forces dominating over body or inertia forces. Hence fluid circulation in a droplet greatly enhances heat transfer. As a result, slip at a wall-fluid interface could have a two fold affect on heat transfer in droplet based thermal systems; the first is a direct result of thermal slip at the fluid-wall interface, the second is due to hydrodynamic slip at the interface which leads to reduction of internal circulation and in turn reduction in heat transfer. In this paper molecular dynamic simulations are used to look at the effects of thermal and hydrodynamic slip separately and then to investigate the cumulative effect of them on heat transfer in moving droplets in a microchannel. The affect of hydrodynamic slip in an isothermal channel is studied and it is observed that circulation is inversely dependent on slip length. A simple model is established that captures this effect and it also shows that the effect of slip on circulation only becomes important when the length scale of the problem is comparable to the order of slip length.","PeriodicalId":12453,"journal":{"name":"Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"60 1","pages":"381-387"},"PeriodicalIF":0.0000,"publicationDate":"2014-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2014.6892306","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Fluid flow in a microchannel is primarily laminar due to viscous forces dominating over body or inertia forces. Hence fluid circulation in a droplet greatly enhances heat transfer. As a result, slip at a wall-fluid interface could have a two fold affect on heat transfer in droplet based thermal systems; the first is a direct result of thermal slip at the fluid-wall interface, the second is due to hydrodynamic slip at the interface which leads to reduction of internal circulation and in turn reduction in heat transfer. In this paper molecular dynamic simulations are used to look at the effects of thermal and hydrodynamic slip separately and then to investigate the cumulative effect of them on heat transfer in moving droplets in a microchannel. The affect of hydrodynamic slip in an isothermal channel is studied and it is observed that circulation is inversely dependent on slip length. A simple model is established that captures this effect and it also shows that the effect of slip on circulation only becomes important when the length scale of the problem is comparable to the order of slip length.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
流体动力和热滑移对液滴热管理系统的影响
流体在微通道中的流动主要是层流,这是由于粘滞力支配着体或惯性力。因此,液滴中的流体循环大大增强了传热。因此,壁面-流体界面的滑移对液滴热系统的传热有双重影响;第一种是流体-壁面界面的热滑移的直接结果,第二种是由于界面的流体动力滑移导致内循环减少,从而减少了传热。本文采用分子动力学模拟分别考察了热滑移和水动力滑移的影响,并研究了它们对微通道中运动液滴传热的累积效应。研究了等温通道中流体动力滑移的影响,发现环流与滑移长度成反比。建立了一个简单的模型来捕捉这种影响,它还表明,只有当问题的长度尺度与滑动长度的顺序相当时,滑动对循环的影响才变得重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Material behavior of SAC305 under high strain rate at high temperature Phase-separation of wetting fluids using nanoporous alumina membranes and micro-glass capillaries Nature-inspired enhanced microscale heat transfer in macro geometry Transient thermal imaging characterization of a die attached optoelectronic device on silicon A model for the free (top) surface deformation of through-silicon vias
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1