High Stability Ultra-Miniature Size OCXO Operating within Wide Temperature Range: Using ASIC with Built-in Oven for OCXO

K. Irie, Jun-ichi Arai, Manabu Ito, Toshiyuki Shinotsuka, Manabu Ishikawa, S. Wakamatsu
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Abstract

This paper describes a high stability ultra-miniature size OCXO operating within wide temperature range using a ASIC with a built-in oven for OCXO. The ASIC realized that the OCXO could be extremely downsized and the maximum operating temperature is getting higher because it has almost all functions including a built-in oven which OCXOs should have. We have achieved about +/−5 ppb in a range of −40 to +95 °C and obtained excellent temperature slope characteristics for $7.0\times 5.0\text{mm}$ size package.
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高稳定性超小型OCXO在宽温度范围内工作:使用内置烤箱的ASIC用于OCXO
本文介绍了一种高稳定性的超小型OCXO,可在宽温度范围内工作。ASIC意识到OCXO可以非常缩小,最高工作温度越来越高,因为它几乎具有所有功能,包括OCXO应该具有的内置烤箱。我们在- 40至+95°C的范围内实现了约+/ - 5 ppb,并在$7.0\times 5.0\text{mm}$尺寸的封装中获得了出色的温度斜率特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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