F. Carastro, Zheng Chen, Alexander Streibel, O. Muehlfeld
{"title":"DCM™1000X – Automotive Power Module Technology Platform Optimized for SiC Traction Inverters","authors":"F. Carastro, Zheng Chen, Alexander Streibel, O. Muehlfeld","doi":"10.1109/APEC42165.2021.9487446","DOIUrl":null,"url":null,"abstract":"This paper introduces the Danfoss DCM1000X power module technology platform, which is developed to meet the harshest requirements of automotive traction inverters, and optimized to fully unleash the capabilities of latest silicon carbide (SiC) power switches. Advanced packaging technologies unique to Danfoss, such as Danfoss Bond Buffer® (DBB®) and ShowerPower® 3D (SP3D®), have been implemented to embrace the cooling and thermo-mechanical challenges in electric vehicle drivetrains. The three-DC-terminal design, and the symmetrical and optimized internal layout, minimize the power loop inductance, and ensure balanced current distribution within the module. As a platform, the DCM1000X offers many customizable features and provides scalable power solutions from 750 V to 1200 V, although this paper will focus on the performances of a 1200 V, 660 A SiC half-bridge module, a leading variant within the family.","PeriodicalId":7050,"journal":{"name":"2021 IEEE Applied Power Electronics Conference and Exposition (APEC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE Applied Power Electronics Conference and Exposition (APEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEC42165.2021.9487446","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper introduces the Danfoss DCM1000X power module technology platform, which is developed to meet the harshest requirements of automotive traction inverters, and optimized to fully unleash the capabilities of latest silicon carbide (SiC) power switches. Advanced packaging technologies unique to Danfoss, such as Danfoss Bond Buffer® (DBB®) and ShowerPower® 3D (SP3D®), have been implemented to embrace the cooling and thermo-mechanical challenges in electric vehicle drivetrains. The three-DC-terminal design, and the symmetrical and optimized internal layout, minimize the power loop inductance, and ensure balanced current distribution within the module. As a platform, the DCM1000X offers many customizable features and provides scalable power solutions from 750 V to 1200 V, although this paper will focus on the performances of a 1200 V, 660 A SiC half-bridge module, a leading variant within the family.
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