QFP plastic cavity carrier design for MPW chip package

Abstract

Before mass production, designed IC will be firstly verified using a Multi Project Wafer (MPW) procedure. How to package the MPW chips in a short time with a reasonable price is the common need of design houses. The Quad Flat Package (QFP) cavity carrier provides a “house” to protect the chips, and is strongly accepted by IC design companies and research parties. But usually, the QFP cavity carrier is shaped by ceramic in a high price. This article will present an EMC (Epoxy Molding Compound) based QFP cavity carrier which is developed by a microelectronic transfer-molding technology with double side film lining the mold parts. The design of EMC based QFP cavity carrier is elaborated and the development of QFP cavity carrier through by Film Assistant Molding (FAM) technology provided by the Boschman molding tool is demonstrated. After unit and strip drawing, molding process with software of mold flow was simulated. The simulation results showed all of the units in the strip can be fully filled and the compound was void free. Together with previous experience in QFN (Quad Flat No-lead Package) cavity products, it is concluded that QFP plastic cavity carriers will become universal kits for MPW chip or testing chip package in an acceptable price and delivery time.