Transparent Antennas for Wireless Systems Based on Patterned Indium Tin Oxide and Flexible Glass

M. Poliks, Yilin Sung, J. Lombardi, Robert Malay, Jeremiah M. Dederick, C. Westgate, Ming-Huang Huang, S. Garner, S. Pollard, C. Daly
{"title":"Transparent Antennas for Wireless Systems Based on Patterned Indium Tin Oxide and Flexible Glass","authors":"M. Poliks, Yilin Sung, J. Lombardi, Robert Malay, Jeremiah M. Dederick, C. Westgate, Ming-Huang Huang, S. Garner, S. Pollard, C. Daly","doi":"10.1109/ECTC.2017.314","DOIUrl":null,"url":null,"abstract":"Efficient antennas were achieved at 2.4 GHz and 5.8 GHz in which a transparent conductor, ITO, was deposited on only one side of the glass through sputtering. Antenna structures including grid, loop, and split ring monopoles were also designed and tested. An ITO layer of 650 nm was needed to consistently maintain a sheet resistance of 10 ohms/square or less to reduce antenna losses. A 100 nm aluminum doped silicon dioxide layer was deposited to buffer the ITO from the flexible glass to ensure high conductivity, and photolithography was used to define the antennas followed by an annealing process to improve the ITO conductivity and transparency. A packaging technique using 3D printed frames, Corning® GPPO connectors, and conducting epoxies yielded good antenna performance in terms of radiation efficiency and mismatch loss. Good agreement between simulations and measurements for packaged devices was obtained. Examples of antenna packaging, measurement results, and performance are presented.","PeriodicalId":6557,"journal":{"name":"2017 IEEE 67th Electronic Components and Technology Conference (ECTC)","volume":"77 1","pages":"1443-1448"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE 67th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2017.314","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 14

Abstract

Efficient antennas were achieved at 2.4 GHz and 5.8 GHz in which a transparent conductor, ITO, was deposited on only one side of the glass through sputtering. Antenna structures including grid, loop, and split ring monopoles were also designed and tested. An ITO layer of 650 nm was needed to consistently maintain a sheet resistance of 10 ohms/square or less to reduce antenna losses. A 100 nm aluminum doped silicon dioxide layer was deposited to buffer the ITO from the flexible glass to ensure high conductivity, and photolithography was used to define the antennas followed by an annealing process to improve the ITO conductivity and transparency. A packaging technique using 3D printed frames, Corning® GPPO connectors, and conducting epoxies yielded good antenna performance in terms of radiation efficiency and mismatch loss. Good agreement between simulations and measurements for packaged devices was obtained. Examples of antenna packaging, measurement results, and performance are presented.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
基于图案氧化铟锡和柔性玻璃的无线系统透明天线
在2.4 GHz和5.8 GHz的频率下,通过溅射将透明导体ITO沉积在玻璃的一侧,从而实现了高效天线。天线结构包括栅极、环极和裂环单极也进行了设计和测试。需要650 nm的ITO层来始终保持10欧姆/平方或更小的片电阻,以减少天线损耗。制备了一层100nm的铝掺杂二氧化硅层,以缓冲柔性玻璃中的ITO以确保高导电性,并采用光刻技术定义天线,然后进行退火工艺以提高ITO的导电性和透明度。采用3D打印框架、康宁®GPPO连接器和导电环氧树脂的封装技术在辐射效率和失配损耗方面产生了良好的天线性能。模拟结果与实测结果吻合较好。给出了天线的封装示例、测量结果和性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Peridynamic Solution of Wetness Equation with Time Dependent Saturated Concentration in ANSYS Framework Axially Tapered Circular Core Polymer Optical Waveguides Enabling Highly Efficient Light Coupling Low Loss Channel-Shuffling Polymer Waveguides: Design and Fabrication Development of Packaging Technology for High Temperature Resistant SiC Module of Automobile Application 3D Packaging of Embedded Opto-Electronic Die and CMOS IC Based on Wet Etched Silicon Interposer
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1