{"title":"Nanoscale engineered surfaces for cooling in electronic devices","authors":"P. Shandilya, A. Shaji, K. Sankaran","doi":"10.1063/1.5122483","DOIUrl":null,"url":null,"abstract":"Nanoscale engineered surfaces can be used as cooling structures (heat sinks) in the integrated circuits. These advanced materials are studied for their performance compared to standard materials to...","PeriodicalId":7262,"journal":{"name":"ADVANCES IN BASIC SCIENCE (ICABS 2019)","volume":"102 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2019-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ADVANCES IN BASIC SCIENCE (ICABS 2019)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1063/1.5122483","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Nanoscale engineered surfaces can be used as cooling structures (heat sinks) in the integrated circuits. These advanced materials are studied for their performance compared to standard materials to...
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