{"title":"Advances in Power Electronics","authors":"C. Bailey","doi":"10.23919/PanPacific48324.2020.9059348","DOIUrl":null,"url":null,"abstract":"Power electronics is seeing significant growth due to electrification of transport, and carbon reduction using renewable energy. Innovations in devices (e.g. wide bandgap materials such as Silicon Carbide and Gallium Nitride) provide the opportunity to design smaller power electronic systems that are highly efficient. A key to realizing these benefits is innovations in packaging and design tools. Traditional materials and packaging architectures need to address the new environments that they will be subjected to higher temperatures, frequencies, and inductances, etc. New design and modelling approaches will be required to support innovations in packaging and reliability predictions. This paper details some of the recent advances in power electronics systems and details some of the challenges that need to be overcome.","PeriodicalId":6691,"journal":{"name":"2020 Pan Pacific Microelectronics Symposium (Pan Pacific)","volume":"39 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2020-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 Pan Pacific Microelectronics Symposium (Pan Pacific)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/PanPacific48324.2020.9059348","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Power electronics is seeing significant growth due to electrification of transport, and carbon reduction using renewable energy. Innovations in devices (e.g. wide bandgap materials such as Silicon Carbide and Gallium Nitride) provide the opportunity to design smaller power electronic systems that are highly efficient. A key to realizing these benefits is innovations in packaging and design tools. Traditional materials and packaging architectures need to address the new environments that they will be subjected to higher temperatures, frequencies, and inductances, etc. New design and modelling approaches will be required to support innovations in packaging and reliability predictions. This paper details some of the recent advances in power electronics systems and details some of the challenges that need to be overcome.
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电力电子学进展
由于交通电气化和使用可再生能源减少碳排放,电力电子产品正在显著增长。器件的创新(如碳化硅和氮化镓等宽带隙材料)为设计更小的高效电力电子系统提供了机会。实现这些好处的关键是包装和设计工具的创新。传统材料和封装架构需要应对新的环境,它们将受到更高的温度、频率和电感等的影响。将需要新的设计和建模方法来支持包装和可靠性预测的创新。本文详细介绍了电力电子系统的一些最新进展,并详细介绍了需要克服的一些挑战。
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