Pub Date : 2020-02-01DOI: 10.23919/PanPacific48324.2020.9059446
J. Fröhlich, D. Gräf, J. Franke, J. Hörber, M. Hedges
Printed electronics offer new possibilities in the design of footprints and integrated mechatronic systems. Fast and uncomplicated customization and cost-efficient fabrication are further benefits of this technology. In combination with other production processes like pick-and-place systems or fused filament fabrication (FFF), functional applications like communication or sensing devices can be produced in a very flexible way. The authors demonstrate how to produce a capacitive sensor system on three millimeter window glass by combining the piezo-jet technology and a pick-and-place system within a single five-axis CNC machine. The piezo-jet system is used to produce the circuitry by printing silver micro paste onto the glass plate. The process is maskless, works with a standoff-distance between one and ten millimeters and can process inks and pastes with a viscosity from 50 mPas to 200,000 mPas. The pick-and-place system puts all necessary surface mounted devices (SMD) directly onto the liquid paste which contains adhesives. The only process that takes place outside the machine is the sintering. However, by integrating an ultra violet (UV) or near infrared (NIR) curing system this process step could also be carried out within the machine. After the sintering the system is fully functional and does not require any further post-processing. The system consists of a micro-controller, two capacitive proximity detection ICs, resistors and capacitors. The digital outputs of the sensors could be used to control any given application, for reasons of illustration the functionality of the system is shown by an additionally mounted LED-strip. The system is easy to design and quick to adapt since the electronic layout is based on the standard layout of the IC-provider and the used software uncomplicated and open-source. Due to the placement at the back of the glass the system is perfectly protected against mechanical and chemical influences. It detects all kind of materials so the sensors can be triggered while wearing gloves or by people with a hand prosthesis. Moreover, the sensitivity can be easily adjusted over the software of the microcontroller which makes the application easy adaptable to several conditions. By recognizing different touch patterns, different operating modes can be performed. Currently the sensor system works as a touch switch, but it could also be adapted to realize a low-cost distance sensor. The flexibility of the used five axis system in combination with the high standoff-distance of the piezo-jet print head offers the possibility to print such systems on a wide spectrum of three-dimensional bodies. Even printing around or into corners is possible. With this method existing components can be functionalized electronically without having to redesign them. The produced demonstrator shows the possibility to extend a component by operating elements, but the capabilities go much further. Existing components can not only be extended by num
{"title":"Customizable Capacitive Sensor System Using Printed Electronics on Window Glass","authors":"J. Fröhlich, D. Gräf, J. Franke, J. Hörber, M. Hedges","doi":"10.23919/PanPacific48324.2020.9059446","DOIUrl":"https://doi.org/10.23919/PanPacific48324.2020.9059446","url":null,"abstract":"Printed electronics offer new possibilities in the design of footprints and integrated mechatronic systems. Fast and uncomplicated customization and cost-efficient fabrication are further benefits of this technology. In combination with other production processes like pick-and-place systems or fused filament fabrication (FFF), functional applications like communication or sensing devices can be produced in a very flexible way. The authors demonstrate how to produce a capacitive sensor system on three millimeter window glass by combining the piezo-jet technology and a pick-and-place system within a single five-axis CNC machine. The piezo-jet system is used to produce the circuitry by printing silver micro paste onto the glass plate. The process is maskless, works with a standoff-distance between one and ten millimeters and can process inks and pastes with a viscosity from 50 mPas to 200,000 mPas. The pick-and-place system puts all necessary surface mounted devices (SMD) directly onto the liquid paste which contains adhesives. The only process that takes place outside the machine is the sintering. However, by integrating an ultra violet (UV) or near infrared (NIR) curing system this process step could also be carried out within the machine. After the sintering the system is fully functional and does not require any further post-processing. The system consists of a micro-controller, two capacitive proximity detection ICs, resistors and capacitors. The digital outputs of the sensors could be used to control any given application, for reasons of illustration the functionality of the system is shown by an additionally mounted LED-strip. The system is easy to design and quick to adapt since the electronic layout is based on the standard layout of the IC-provider and the used software uncomplicated and open-source. Due to the placement at the back of the glass the system is perfectly protected against mechanical and chemical influences. It detects all kind of materials so the sensors can be triggered while wearing gloves or by people with a hand prosthesis. Moreover, the sensitivity can be easily adjusted over the software of the microcontroller which makes the application easy adaptable to several conditions. By recognizing different touch patterns, different operating modes can be performed. Currently the sensor system works as a touch switch, but it could also be adapted to realize a low-cost distance sensor. The flexibility of the used five axis system in combination with the high standoff-distance of the piezo-jet print head offers the possibility to print such systems on a wide spectrum of three-dimensional bodies. Even printing around or into corners is possible. With this method existing components can be functionalized electronically without having to redesign them. The produced demonstrator shows the possibility to extend a component by operating elements, but the capabilities go much further. Existing components can not only be extended by num","PeriodicalId":6691,"journal":{"name":"2020 Pan Pacific Microelectronics Symposium (Pan Pacific)","volume":"14 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2020-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73232706","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-02-01DOI: 10.23919/PanPacific48324.2020.9059402
Sinan Su, F. Akkara, T. Sanders, Jiawei Zhang, John L. Evans, Gregory Harris
In this paper, a direct comparison was conducted between SnPb and lead-free solder joints focused on long-term thermal cycling reliability after being exposed to high-temperature aging for a long period of time using two test vehicle designs. Ball Grid Array (BGA) packages with SAC305 (Sn-3%Ag-0.5%Cu) and eutectic SnPb (63%Sn-37%Pb) were compared in this research. After the test, IMC thickness and failure modes of BGA components on the different test vehicles were investigated. The results from the post-test examination were analyzed to explain certain unexpected outcomes of the two test vehicle designs when comparing the reliability results among the two programs of tests. The results showed that for the TC1 test vehicle, SAC305 solder joints show better reliability than the SnPb solder joints; while the reliability of the SnPb solder joints outperformed the SAC305 solder joints after 6 months of high-temperature aging for the TV7 test vehicle. Meanwhile, even on the same test vehicle, the failure modes varied between components with SAC305 and SnPb solder joints.
{"title":"Reexamination of Thermal Cycling Reliability of BGA Components with SNAGCU and SnPb Solder Joints on Different Board Designs","authors":"Sinan Su, F. Akkara, T. Sanders, Jiawei Zhang, John L. Evans, Gregory Harris","doi":"10.23919/PanPacific48324.2020.9059402","DOIUrl":"https://doi.org/10.23919/PanPacific48324.2020.9059402","url":null,"abstract":"In this paper, a direct comparison was conducted between SnPb and lead-free solder joints focused on long-term thermal cycling reliability after being exposed to high-temperature aging for a long period of time using two test vehicle designs. Ball Grid Array (BGA) packages with SAC305 (Sn-3%Ag-0.5%Cu) and eutectic SnPb (63%Sn-37%Pb) were compared in this research. After the test, IMC thickness and failure modes of BGA components on the different test vehicles were investigated. The results from the post-test examination were analyzed to explain certain unexpected outcomes of the two test vehicle designs when comparing the reliability results among the two programs of tests. The results showed that for the TC1 test vehicle, SAC305 solder joints show better reliability than the SnPb solder joints; while the reliability of the SnPb solder joints outperformed the SAC305 solder joints after 6 months of high-temperature aging for the TV7 test vehicle. Meanwhile, even on the same test vehicle, the failure modes varied between components with SAC305 and SnPb solder joints.","PeriodicalId":6691,"journal":{"name":"2020 Pan Pacific Microelectronics Symposium (Pan Pacific)","volume":"819 1","pages":"1-8"},"PeriodicalIF":0.0,"publicationDate":"2020-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77543118","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-02-01DOI: 10.23919/PanPacific48324.2020.9059322
Michael Ford
The concept of the Industrial Internet of Things (IIoT), has gained significant momentum in the industry recently, heralding a variety of associated solutions and values. Most of these unfortunately represent little more than desperate marketing stories from legacy providers, or unsubstantiated promises from exploitative startups, triggering significant needless investment in narrowly focused, often bespoke technologies, that ultimately represent unnecessary deployment and ongoing ownership costs.
{"title":"The True Business Impact of IIoT Technology","authors":"Michael Ford","doi":"10.23919/PanPacific48324.2020.9059322","DOIUrl":"https://doi.org/10.23919/PanPacific48324.2020.9059322","url":null,"abstract":"The concept of the Industrial Internet of Things (IIoT), has gained significant momentum in the industry recently, heralding a variety of associated solutions and values. Most of these unfortunately represent little more than desperate marketing stories from legacy providers, or unsubstantiated promises from exploitative startups, triggering significant needless investment in narrowly focused, often bespoke technologies, that ultimately represent unnecessary deployment and ongoing ownership costs.","PeriodicalId":6691,"journal":{"name":"2020 Pan Pacific Microelectronics Symposium (Pan Pacific)","volume":"7 1","pages":"1-7"},"PeriodicalIF":0.0,"publicationDate":"2020-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80075411","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-02-01DOI: 10.23919/PanPacific48324.2020.9059353
S. Neermann, M. Steindl, J. Franke, Edgar Mayer, Michael Schmidt
Printed Electronics creates new areas of applications with a new manner of manufacturing electronics. Due to its technical and 3D design freedom, new markets and innovative products arise that were initially unthinkable. However, the focus of research is currently on mastering and improving the printing process. The subsequent process step of drying and densifying the printed structures to achieve high conductivities in the shortest possible time is up to now hardly considered. This paper treats the inquiry of fitted and optimized parameters of alternative promising photonic sintering methods for printed electronics compared to the much more time-intensive state of the art sintering process in a furnace. These photonic sintering methods comprise the near infrared, ultraviolet light as well as laser irradiation of the printed structures. Photonic sintering promises faster and more efficient curing and sintering due to the direct and selective application of energy to the printing structures without damaging the temperature-sensitive substrates. As substrate materials ABS and PC-ABS, as well as a glass material were used. Both polymer materials are standard and technical thermoplastics which are available at the market in huge quantities at low price. For the manufacture of printed circuits, a dispense printer was used, in order to process a low-cost silver-based micro particle paste. The evaluation of the sintering result was carried out based on the electrical conductivity of the printed conductor path and the adhesion strength on the substrate. In addition, the sintering time required for the curing of the structures as well as impacts on the substrate or the printed tracks due to photonic treatment were taken into account. To perform the experiments, two different print layouts were set up in order to be able to assess the electrical properties on the first layout and the adhesion on the second layout. To obtain a detailed statement on the exploration on the photonic sintering methods, a fully factorial design plan was conducted. For the near-infrared irradiation, the important parameters were the irradiation duration and the irradiation power. While sintered by ultraviolet light, the parameters were irradiation time, as well as the distance between the sample surface and the UV emitter. In the treatment by means of laser radiation, laser power and the motion speed were identified as the relevant parameters. In order to be able to draw a comparison to the mainly used sintering method, samples were also sintered in a furnace. The results show a significant reduction of the sintering time to a few seconds with comparable and even significantly better electrical and mechanical properties.
{"title":"Qualification of NIR, UV and Laser Irradiation as Alternative Photonic Sintering Methods for Printed Electronics","authors":"S. Neermann, M. Steindl, J. Franke, Edgar Mayer, Michael Schmidt","doi":"10.23919/PanPacific48324.2020.9059353","DOIUrl":"https://doi.org/10.23919/PanPacific48324.2020.9059353","url":null,"abstract":"Printed Electronics creates new areas of applications with a new manner of manufacturing electronics. Due to its technical and 3D design freedom, new markets and innovative products arise that were initially unthinkable. However, the focus of research is currently on mastering and improving the printing process. The subsequent process step of drying and densifying the printed structures to achieve high conductivities in the shortest possible time is up to now hardly considered. This paper treats the inquiry of fitted and optimized parameters of alternative promising photonic sintering methods for printed electronics compared to the much more time-intensive state of the art sintering process in a furnace. These photonic sintering methods comprise the near infrared, ultraviolet light as well as laser irradiation of the printed structures. Photonic sintering promises faster and more efficient curing and sintering due to the direct and selective application of energy to the printing structures without damaging the temperature-sensitive substrates. As substrate materials ABS and PC-ABS, as well as a glass material were used. Both polymer materials are standard and technical thermoplastics which are available at the market in huge quantities at low price. For the manufacture of printed circuits, a dispense printer was used, in order to process a low-cost silver-based micro particle paste. The evaluation of the sintering result was carried out based on the electrical conductivity of the printed conductor path and the adhesion strength on the substrate. In addition, the sintering time required for the curing of the structures as well as impacts on the substrate or the printed tracks due to photonic treatment were taken into account. To perform the experiments, two different print layouts were set up in order to be able to assess the electrical properties on the first layout and the adhesion on the second layout. To obtain a detailed statement on the exploration on the photonic sintering methods, a fully factorial design plan was conducted. For the near-infrared irradiation, the important parameters were the irradiation duration and the irradiation power. While sintered by ultraviolet light, the parameters were irradiation time, as well as the distance between the sample surface and the UV emitter. In the treatment by means of laser radiation, laser power and the motion speed were identified as the relevant parameters. In order to be able to draw a comparison to the mainly used sintering method, samples were also sintered in a furnace. The results show a significant reduction of the sintering time to a few seconds with comparable and even significantly better electrical and mechanical properties.","PeriodicalId":6691,"journal":{"name":"2020 Pan Pacific Microelectronics Symposium (Pan Pacific)","volume":"87 1","pages":"1-8"},"PeriodicalIF":0.0,"publicationDate":"2020-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86055260","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-02-01DOI: 10.23919/PanPacific48324.2020.9059500
John Cooper, Daniel Kwak
We will look at reliability testing of consumer products, especially for startup and smaller to medium size companies, and which of these test and analytical tools can be used, and how they affect the product development process.
{"title":"Reliability Testing of Consumer Products","authors":"John Cooper, Daniel Kwak","doi":"10.23919/PanPacific48324.2020.9059500","DOIUrl":"https://doi.org/10.23919/PanPacific48324.2020.9059500","url":null,"abstract":"We will look at reliability testing of consumer products, especially for startup and smaller to medium size companies, and which of these test and analytical tools can be used, and how they affect the product development process.","PeriodicalId":6691,"journal":{"name":"2020 Pan Pacific Microelectronics Symposium (Pan Pacific)","volume":"1 1","pages":"1-9"},"PeriodicalIF":0.0,"publicationDate":"2020-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77120656","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-02-01DOI: 10.23919/PanPacific48324.2020.9059394
Raaga Kannan, R. Lasky
The automotive industry, once predicting the arrival of fully autonomous vehicles by 2020, has backed down from such optimism as industry experts recognize the difficulties of bringing level 5 automation into the hands of consumers. This paper will first introduce the stages of automation defined by the Society of Automotive Engineers (SAE International). Secondly, it will examine the challenges required to progress from existing advanced driver-assistance systems (ADAS) to level 4 and 5 autonomous vehicles. This section will focus on the need for higher precision sensors and software standards as well as the development of cognitive functions such as perception in existing software to navigate daily traffic patterns encountered by human drivers. The inability of current AI technologies to accomplish such a feat will then be discussed. Next, assuming automakers successfully develop the necessary technologies for autonomous vehicles, difficulties of testing the safety of such vehicles will be addressed. This paper will conclude with a discussion of the dangers of releasing level 3 autopilot systems to consumers.
{"title":"Autonomous Vehicles Still Decades Away: 2019","authors":"Raaga Kannan, R. Lasky","doi":"10.23919/PanPacific48324.2020.9059394","DOIUrl":"https://doi.org/10.23919/PanPacific48324.2020.9059394","url":null,"abstract":"The automotive industry, once predicting the arrival of fully autonomous vehicles by 2020, has backed down from such optimism as industry experts recognize the difficulties of bringing level 5 automation into the hands of consumers. This paper will first introduce the stages of automation defined by the Society of Automotive Engineers (SAE International). Secondly, it will examine the challenges required to progress from existing advanced driver-assistance systems (ADAS) to level 4 and 5 autonomous vehicles. This section will focus on the need for higher precision sensors and software standards as well as the development of cognitive functions such as perception in existing software to navigate daily traffic patterns encountered by human drivers. The inability of current AI technologies to accomplish such a feat will then be discussed. Next, assuming automakers successfully develop the necessary technologies for autonomous vehicles, difficulties of testing the safety of such vehicles will be addressed. This paper will conclude with a discussion of the dangers of releasing level 3 autopilot systems to consumers.","PeriodicalId":6691,"journal":{"name":"2020 Pan Pacific Microelectronics Symposium (Pan Pacific)","volume":"1 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2020-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86311609","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-02-01DOI: 10.23919/PanPacific48324.2020.9059437
N. Bajad, D. Santos, K. Srihari, V. Venkatadri
A design of experiment (DOE) analysis is reported on data from warpage simulations using finite element analysis (FEA) of a lidded electronics package. Warpage in a lid of an optical electronics package can detrimentally affect the reliability of the package as well as its optical performance. The present study focuses on the variety of materials and designs of lids relevant to recent technologies in electronics packaging. The FEA formulation in this study accurately predicts deformation and warpage in the elastic region with optimal computational time achieved through a choice of boundary conditions and mesh sensitivity studies. This study mainly focuses on how warpage is affecting the lid deformation and techniques to characterize it. FEA is used to create a prototype which is similar to the actual product. The experiment is designed considering different variables such as both the design and the material of the lid. DOE and subsequent statistical analyses are applied to understand the correlation between these parameters. The most significant parameter in terms of the warpage deformation is addressed. Based on this study, the appropriate design and material are suggested for the development of the lid over the package. This becomes helpful when there is an optoelectronic package undergoing thermomechanical loading; warpage may not only adversely affect solder joints but other parts of the package as well. So, in this work, characterization of the lid of the package affected by warpage is the focus area. The analysis indicates that there is no significant interaction between the two parameters expected to affect the warpage in the lid. Material properties of the lid are found to have a greater effect on the warpage of the lid as compared to variabilities introduced in lid designs in this study. This study will be helpful for the development of technologically advanced packages associated with optoelectronics.
{"title":"An FEA and DOE Analysis to Predict Deformation and Warpage of Optoelectronics Package Lids","authors":"N. Bajad, D. Santos, K. Srihari, V. Venkatadri","doi":"10.23919/PanPacific48324.2020.9059437","DOIUrl":"https://doi.org/10.23919/PanPacific48324.2020.9059437","url":null,"abstract":"A design of experiment (DOE) analysis is reported on data from warpage simulations using finite element analysis (FEA) of a lidded electronics package. Warpage in a lid of an optical electronics package can detrimentally affect the reliability of the package as well as its optical performance. The present study focuses on the variety of materials and designs of lids relevant to recent technologies in electronics packaging. The FEA formulation in this study accurately predicts deformation and warpage in the elastic region with optimal computational time achieved through a choice of boundary conditions and mesh sensitivity studies. This study mainly focuses on how warpage is affecting the lid deformation and techniques to characterize it. FEA is used to create a prototype which is similar to the actual product. The experiment is designed considering different variables such as both the design and the material of the lid. DOE and subsequent statistical analyses are applied to understand the correlation between these parameters. The most significant parameter in terms of the warpage deformation is addressed. Based on this study, the appropriate design and material are suggested for the development of the lid over the package. This becomes helpful when there is an optoelectronic package undergoing thermomechanical loading; warpage may not only adversely affect solder joints but other parts of the package as well. So, in this work, characterization of the lid of the package affected by warpage is the focus area. The analysis indicates that there is no significant interaction between the two parameters expected to affect the warpage in the lid. Material properties of the lid are found to have a greater effect on the warpage of the lid as compared to variabilities introduced in lid designs in this study. This study will be helpful for the development of technologically advanced packages associated with optoelectronics.","PeriodicalId":6691,"journal":{"name":"2020 Pan Pacific Microelectronics Symposium (Pan Pacific)","volume":"7 1","pages":"1-7"},"PeriodicalIF":0.0,"publicationDate":"2020-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85263699","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-02-01DOI: 10.23919/PanPacific48324.2020.9059479
Mike Konrad
At its peak between 98–117 AD, the Roman Empire represented twenty percent of the world's population. While the Roman civilization can be credited with many technical and societal inventions, perhaps among the most important was the construction of aqueducts (Figure 1).
{"title":"ECM and IOT How to Predict, Quantify, and Mitigate ECM Failure Potential","authors":"Mike Konrad","doi":"10.23919/PanPacific48324.2020.9059479","DOIUrl":"https://doi.org/10.23919/PanPacific48324.2020.9059479","url":null,"abstract":"At its peak between 98–117 AD, the Roman Empire represented twenty percent of the world's population. While the Roman civilization can be credited with many technical and societal inventions, perhaps among the most important was the construction of aqueducts (Figure 1).","PeriodicalId":6691,"journal":{"name":"2020 Pan Pacific Microelectronics Symposium (Pan Pacific)","volume":"84 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2020-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74549325","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-02-01DOI: 10.23919/PanPacific48324.2020.9059319
T. Munson
Since the 1980s the electronics industry has utilized ion chromatography (IC) analysis to understand the relationship of ions, and some organics, to product reliability. From component and board fabrication to complete electronic assemblies and their end-use environment, IC analysis has been the de facto method for evaluating ionic cleanliness of electronic hardware. Typical ions accounted for include chloride, bromide, nitrate, sulfate, weak-organic acid (WOA), sodium and ammonium. Environmental and other concerns have driven the industry to adopt myriad flux formulations, which has created a need to further differentiate weak-organic acids beyond what a typical IC system using conductivity can provide. By utilizing an Ion Chromatography/Mass Spectroscopy (IC/MS) system optimized for organic separation, we can use the same IC column technology for the typical suite of anion/organic species, then run the sample through a quad-pole mass spectrometer which provides the molecular weight assessment of organics for over two dozen channels. This capability is critical to our failure analysis work at Foresite, as it allows for identification of specific organic acids and flux activators. This information can aid in identifying specific residue sources (e.g. board fabrication, SMT paste flux, waver solder liquid flux, hand solder flux or a completely different, possibly unauthorized, source.
{"title":"Failure Analysis - Using Ion Chromatography and Ion Chromatography/Mass Spec (IC/MS)","authors":"T. Munson","doi":"10.23919/PanPacific48324.2020.9059319","DOIUrl":"https://doi.org/10.23919/PanPacific48324.2020.9059319","url":null,"abstract":"Since the 1980s the electronics industry has utilized ion chromatography (IC) analysis to understand the relationship of ions, and some organics, to product reliability. From component and board fabrication to complete electronic assemblies and their end-use environment, IC analysis has been the de facto method for evaluating ionic cleanliness of electronic hardware. Typical ions accounted for include chloride, bromide, nitrate, sulfate, weak-organic acid (WOA), sodium and ammonium. Environmental and other concerns have driven the industry to adopt myriad flux formulations, which has created a need to further differentiate weak-organic acids beyond what a typical IC system using conductivity can provide. By utilizing an Ion Chromatography/Mass Spectroscopy (IC/MS) system optimized for organic separation, we can use the same IC column technology for the typical suite of anion/organic species, then run the sample through a quad-pole mass spectrometer which provides the molecular weight assessment of organics for over two dozen channels. This capability is critical to our failure analysis work at Foresite, as it allows for identification of specific organic acids and flux activators. This information can aid in identifying specific residue sources (e.g. board fabrication, SMT paste flux, waver solder liquid flux, hand solder flux or a completely different, possibly unauthorized, source.","PeriodicalId":6691,"journal":{"name":"2020 Pan Pacific Microelectronics Symposium (Pan Pacific)","volume":"27 1","pages":"1-13"},"PeriodicalIF":0.0,"publicationDate":"2020-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79577592","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2020-02-01DOI: 10.23919/PanPacific48324.2020.9059530
Annaka Balch, R. Lasky
This project compares past board assembly roadmaps with actual technological outcomes. Its conclusions are mixed: some aspects that the roadmaps covered were very accurate, while others could use improvement. This paper also draws general conclusions on the outline and readability of the board assembly roadmaps. These roadmaps were given to Dr. Lasky and me at no cost from Marc Benowitz, the CEO of iNEMI, for the purpose of this project. This paper examined the progression of predictions across seven significant aspects of board assembly covered in the 1994, 2002,2007, 2013 and 2017 roadmaps: 1) Conversion Costs, 2) NPI Cycle Time, 3) Component Trends, 4) Solder Paste, 5) Bar Solder, 6) Wave Solder Flux and 7) Die Attach Adhesives. Conversion costs were quantified across the 1994, 2002 and 2007 roadmaps and were found to be accurate, if not conservatively estimated (see Figure 5). Even the estimate in the 1994 Roadmap for 15 years out was within 0.05 cents of the actual technological outcome per I/O. NPI predictions were found to be extremely accurate quantitatively as well as qualitatively. The area with the most discrepancy between the roadmaps' predictions and actual technological outcomes is in component trends. Maximum I/O density, minimum pitch for area array packages and chip speed placement were all overestimated markedly, especially in the earlier roadmaps. It should be noted that there are discrepancies between these roadmaps, but this project aims to bridge these discrepancies in a comprehensive fashion to better inform iNEMI for future roadmaps.
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