High productivity and damage-free ultrasonic anisotropic conductive film (ACF) bonding for touch screen panel (TSP) assemblies

Seunghwan Kim, Youngjae Kim, H. Park, K. Paik
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引用次数: 1

Abstract

In this study, bonding time for touch screen panel (TSP) assemblies were reduced by two third using an ultrasonic (U/S) horn which fits the shape of the entire TSP bonding area. Most TSPs have at least two bonding areas on the substrates with different heights due to structural design of touch sensing. Using conventional thermo-compression anisotropic conductive film (ACF) bonding, each bonding area should be separately bonded to perform suitable interconnections with uniform pressure and a temperature due to the step height among the bonding areas. However, in U/S bonding, the bonding area could be bonded all at the same time using the U/S horn which fits the bonding area. The test vehicles were capacitive TSPs which consist of three layers of polyethylene terephthalate (PET) substrates. The TSP had three separated bonding areas. Two of them were on the double layer PET substrate. The other one located in the middle of the whole bonding area was on the single layer PET substrate. Therefore, the middle bonding area was 210 μm lower than the other two bonding areas. This complicated TSP structure requires three separate ACF bonding using conventional ACF bonding method. When using a fitted U/S horn, the in-situ ACF temperatures for all bonding areas showed negligible deviation less than 5°C. After U/S bonding for 15 seconds at 2 MPa bonding pressure and 150°C ACF temperature, the adhesion strength of the ACF joint was higher than 650 gf/cm. No damage was observed on the electrode and the substrate. Also, the ACF joints had stable electrical continuities. In conclusion, U/S ACF bonding with fitted horn was successfully demonstrated for high productivity TSP assemblies.
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用于触摸屏面板(TSP)组件的高生产率和无损伤超声各向异性导电膜(ACF)粘合
在这项研究中,使用适合整个TSP键合区域形状的超声波(U/S)喇叭,将触摸屏面板(TSP)组件的键合时间缩短了三分之二。由于触觉传感的结构设计,大多数tsp在衬底上至少有两个不同高度的键合区域。采用传统的热压缩各向异性导电膜(ACF)键合时,由于键合区域之间的台阶高度,每个键合区域应单独键合,以在均匀的压力和温度下进行合适的互连。而在U/S键合中,使用与键合区域相匹配的U/S角可以同时对所有键合区域进行键合。测试车辆是电容式tsp,由三层聚对苯二甲酸乙二醇酯(PET)衬底组成。TSP有三个分离的键合区。其中两个在双层PET基板上。另一个位于整个键合区域的中间,位于单层PET基板上。因此,中间键合区域比其他两个键合区域小210 μm。这种复杂的TSP结构需要采用传统的ACF键合方法进行3个单独的ACF键合。当使用安装的U/S喇叭时,所有键合区域的原位ACF温度偏差小于5°C,可以忽略不计。在2 MPa键合压力和150℃ACF温度下,U/S键合15秒后,ACF接头的粘接强度高于650 gf/cm。在电极和衬底上未观察到损伤。同时,ACF接头具有稳定的电连续性。总之,U/S ACF与贴合喇叭的结合成功地证明了TSP组件的高生产率。
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Parasitic electrical and electromagnetic effects Heat management Passive electronic components Interconnection technology Reliability and maintainability
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