X Sauvage , L Thilly , F Lecouturier , A Guillet , D Blavette
{"title":"FIM and 3D atom probe analysis of Cu/Nb nanocomposite wires","authors":"X Sauvage , L Thilly , F Lecouturier , A Guillet , D Blavette","doi":"10.1016/S0965-9773(99)00386-4","DOIUrl":null,"url":null,"abstract":"<div><p><span>Two kinds of Cu/Nb nanocomposite wires were investigated using field ion microscopy (FIM) and 3D </span>atom probe<span>. These two techniques revealed for the first time the nanoscale microstructure of nanocomposite wire cross sections. FIM investigations confirmed the Cu and Nb texture and the disorientation between (111) Cu and (110) Nb planes. Low angle Nb/Nb grain boudaries were also observed. Thanks to 3D atom probe, parts of niobium fibres and copper channels a few nanometer width were mapped out in 3D. Smooth Cu/Nb interfaces were attributed to stress-induced diffusion. Shear bands, observed perpendicular to the wire axis, were attributed to tracks of moving dislocations in a copper channel.</span></p></div>","PeriodicalId":18878,"journal":{"name":"Nanostructured Materials","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1999-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/S0965-9773(99)00386-4","citationCount":"21","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nanostructured Materials","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0965977399003864","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 21
Abstract
Two kinds of Cu/Nb nanocomposite wires were investigated using field ion microscopy (FIM) and 3D atom probe. These two techniques revealed for the first time the nanoscale microstructure of nanocomposite wire cross sections. FIM investigations confirmed the Cu and Nb texture and the disorientation between (111) Cu and (110) Nb planes. Low angle Nb/Nb grain boudaries were also observed. Thanks to 3D atom probe, parts of niobium fibres and copper channels a few nanometer width were mapped out in 3D. Smooth Cu/Nb interfaces were attributed to stress-induced diffusion. Shear bands, observed perpendicular to the wire axis, were attributed to tracks of moving dislocations in a copper channel.
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