Numerical model with competitively adsorptive mechanism for copper electrodeposition of TSV

Abstract

The competitive adsorption between suppressor and accelerator is the crucial behavior to achieve void-free filling of TSV during electrodeposition. Convective velocity and potential on the reactive electrode surface are two important factors for adsorption of additives. In this paper, a method of calculating the competitively adsorptive parameter Kads is found to quantize the effect of these factors based on investigating the distribution of potential and convective velocity in via. And a special competitively adsorptive parameter value as threshold value K0 is defined to estimate which represents the leading function between suppressor and accelerator in competitive adsorption, and the value of K0 is calculated as 1.631×10-7m/s. Furthermore, TSV filling model with diverse diameter is built, and the simulation results are consistent with that of experiment.