Noise Performance of Sub-100-nm Metamorphic HEMT Technologies

F. Heinz, F. Thome, A. Leuther, O. Ambacher
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引用次数: 7

Abstract

This paper reports the small-signal and noise modeling of InGaAs metamorphic high-electron-mobility transistors at room temperature. Three technologies with gate length of 100 nm, 50 nm, and 35 nm are investigated and the mechanisms causing noise in the different devices are modeled. Technologies that have been scaled and processed in one foundry are modeled with the same model topology which allows for maximal comparability. In this way, a consistent comparison of the effects causing noise in sub-100 nm HEMTs is possible. It is shown that an increase of the channel noise in combination with increased gate leakage currents causes the noise figure to not improve as expected when scaling to ultra short gate length.
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亚100nm变质HEMT技术的噪声性能
本文报道了室温下InGaAs变质高电子迁移率晶体管的小信号和噪声建模。研究了栅极长度为100 nm、50 nm和35 nm的三种技术,并对不同器件中产生噪声的机理进行了建模。在一个铸造厂中进行缩放和处理的技术使用相同的模型拓扑进行建模,从而实现最大的可比性。通过这种方式,可以对在100 nm以下的hemt中引起噪声的效应进行一致的比较。结果表明,通道噪声的增加与栅极泄漏电流的增加相结合,导致当缩放到超短栅极长度时,噪声系数没有像预期的那样改善。
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