Dual-band millimeter-wave interleaved antenna array exploiting low-cost PCB technology for high speed 5G communication

Abstract

In this paper, a novel dual-band co-aperture antenna array with high bandwidth is presented. The proposed frequency bands of interest are E-band and LMDS which can work simultaneously in a dual-band mm-wave radio to achieve high throughput. The distribution network is based on the combination of Substrate-Integrated-Waveguide (SIW) and stripline technologies. These feed networks co-exist in a low-cost PCB with 4 metal layers with minimal interference. The SIW distribution network feeds slot apertures with a special offset from the center axis of the waveguides, while the stripline lines excite U-shaped patch antennas by vertical vias. A 4×4 dual-band E-band/LMDS array prototype is presented to validate the concept. The dual-band antenna array is approximately 12mm×12mm in size realized on a Rogers 4350 substrate. Measured results versus simulations have been presented and discussed. This dual-band technique can be a great candidate for the multi-Giga-bit/s (Gbps) cellular applications for 5G communication and is compatible with low cost multilayer technologies.