S. Shahramian, M. Holyoak, Amit Singh, B. J. Farahani, Y. Baeyens
{"title":"A fully integrated scalable W-band phased-array module with integrated antennas, self-alignment and self-test","authors":"S. Shahramian, M. Holyoak, Amit Singh, B. J. Farahani, Y. Baeyens","doi":"10.1109/ISSCC.2018.8310190","DOIUrl":null,"url":null,"abstract":"Advanced SiGe BiCMOS and CMOS processes continue to push the frontier on millimeter-wave (mm-wave) and highly integrated phased-array systems for a variety of communication applications [1,3]. Furthermore, next-generation mobile technology (5G) demands ultra-low latency and high data-rates with ubiquitous deployment supporting multi-users through the use of pico-cells. These cells may require up to hundreds of active elements capable of producing thousands of beam patterns. In order to make wide adoption of such mm-wave systems a reality, the overall cost of the system must be significantly reduced. This can be accomplished through several means. First, producing highly-integrated phased arrays eliminates the need for additional external components (such as expensive mm-wave synthesizers, amplifiers and switches), which reduces the overall system costs. Second, eliminating exotic packaging processes and materials would allow low-cost traditional manufacturing techniques to be applied to mm-wave systems. Lastly, incorporating self-test, fault-detection, health-monitoring and self-calibration into the RFIC significantly reduces the costs of factory testing (by eliminating the need for any mm-wave verifications) and enables remote-maintenance and system-reconfiguration in case of failures.","PeriodicalId":6617,"journal":{"name":"2018 IEEE International Solid - State Circuits Conference - (ISSCC)","volume":"66 1","pages":"74-76"},"PeriodicalIF":0.0000,"publicationDate":"2018-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"39","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Solid - State Circuits Conference - (ISSCC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.2018.8310190","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 39
Abstract
Advanced SiGe BiCMOS and CMOS processes continue to push the frontier on millimeter-wave (mm-wave) and highly integrated phased-array systems for a variety of communication applications [1,3]. Furthermore, next-generation mobile technology (5G) demands ultra-low latency and high data-rates with ubiquitous deployment supporting multi-users through the use of pico-cells. These cells may require up to hundreds of active elements capable of producing thousands of beam patterns. In order to make wide adoption of such mm-wave systems a reality, the overall cost of the system must be significantly reduced. This can be accomplished through several means. First, producing highly-integrated phased arrays eliminates the need for additional external components (such as expensive mm-wave synthesizers, amplifiers and switches), which reduces the overall system costs. Second, eliminating exotic packaging processes and materials would allow low-cost traditional manufacturing techniques to be applied to mm-wave systems. Lastly, incorporating self-test, fault-detection, health-monitoring and self-calibration into the RFIC significantly reduces the costs of factory testing (by eliminating the need for any mm-wave verifications) and enables remote-maintenance and system-reconfiguration in case of failures.