{"title":"Novel fabrication of integrated submillimeter circuits","authors":"K.W. Nye, Q. Xiao, J. Hesler, T. Crowe","doi":"10.1109/ICIMW.2002.1076086","DOIUrl":null,"url":null,"abstract":"Backside wafer processing has been developed for discrete beamlead diodes and beamlead MMICs. Backside etching allows arbitrary substrate geometry. The beamleads are used to make electrical connections to a waveguide block and/or serve as substrateless transmission lines. The fabrication of an 82.5 to 330 GHz MMIC balanced frequency quadrupler is presented.","PeriodicalId":23431,"journal":{"name":"Twenty Seventh International Conference on Infrared and Millimeter Waves","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Twenty Seventh International Conference on Infrared and Millimeter Waves","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICIMW.2002.1076086","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
Backside wafer processing has been developed for discrete beamlead diodes and beamlead MMICs. Backside etching allows arbitrary substrate geometry. The beamleads are used to make electrical connections to a waveguide block and/or serve as substrateless transmission lines. The fabrication of an 82.5 to 330 GHz MMIC balanced frequency quadrupler is presented.
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