Thermal time shifting: Leveraging phase change materials to reduce cooling costs in warehouse-scale computers

Matt Skach, Manish Arora, Chang-Hong Hsu, Qi Li, D. Tullsen, Lingjia Tang, Jason Mars
{"title":"Thermal time shifting: Leveraging phase change materials to reduce cooling costs in warehouse-scale computers","authors":"Matt Skach, Manish Arora, Chang-Hong Hsu, Qi Li, D. Tullsen, Lingjia Tang, Jason Mars","doi":"10.1145/2749469.2749474","DOIUrl":null,"url":null,"abstract":"Datacenters, or warehouse scale computers, are rapidly increasing in size and power consumption. However, this growth comes at the cost of an increasing thermal load that must be removed to prevent overheating and server failure. In this paper, we propose to use phase changing materials (PCM) to shape the thermal load of a datacenter, absorbing and releasing heat when it is advantageous to do so. We present and validate a methodology to study the impact of PCM on a datacenter, and evaluate two important opportunities for cost savings. We find that in a datacenter with full cooling system subscription, PCM can reduce the necessary cooling system size by up to 12% without impacting peak throughput, or increase the number of servers by up to 14.6% without increasing the cooling load. In a thermally constrained setting, PCM can increase peak throughput up to 69% while delaying the onset of thermal limits by over 3 hours.","PeriodicalId":6878,"journal":{"name":"2015 ACM/IEEE 42nd Annual International Symposium on Computer Architecture (ISCA)","volume":"44 1","pages":"439-449"},"PeriodicalIF":0.0000,"publicationDate":"2015-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"41","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 ACM/IEEE 42nd Annual International Symposium on Computer Architecture (ISCA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/2749469.2749474","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 41

Abstract

Datacenters, or warehouse scale computers, are rapidly increasing in size and power consumption. However, this growth comes at the cost of an increasing thermal load that must be removed to prevent overheating and server failure. In this paper, we propose to use phase changing materials (PCM) to shape the thermal load of a datacenter, absorbing and releasing heat when it is advantageous to do so. We present and validate a methodology to study the impact of PCM on a datacenter, and evaluate two important opportunities for cost savings. We find that in a datacenter with full cooling system subscription, PCM can reduce the necessary cooling system size by up to 12% without impacting peak throughput, or increase the number of servers by up to 14.6% without increasing the cooling load. In a thermally constrained setting, PCM can increase peak throughput up to 69% while delaying the onset of thermal limits by over 3 hours.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
热时移:利用相变材料来降低仓库级计算机的冷却成本
数据中心或仓库级计算机的规模和功耗正在迅速增加。然而,这种增长是以不断增加的热负载为代价的,必须消除热负载以防止过热和服务器故障。在本文中,我们建议使用相变材料(PCM)来塑造数据中心的热负荷,在有利的时候吸收和释放热量。我们提出并验证了一种方法来研究PCM对数据中心的影响,并评估了节省成本的两个重要机会。我们发现,在完全订购冷却系统的数据中心中,PCM可以在不影响峰值吞吐量的情况下将必要的冷却系统大小减少多达12%,或者在不增加冷却负载的情况下将服务器数量增加多达14.6%。在热受限的环境中,PCM可以将峰值吞吐量提高69%,同时将热限制的开始延迟3小时以上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Redundant Memory Mappings for fast access to large memories Multiple Clone Row DRAM: A low latency and area optimized DRAM Manycore Network Interfaces for in-memory rack-scale computing Coherence protocol for transparent management of scratchpad memories in shared memory manycore architectures ShiDianNao: Shifting vision processing closer to the sensor
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1