Modeling Maximum Stresses in Each Layer for Layer-by-Layer Deposition of the Direct Metal Laser Sintering Process for Different Scanning Patterns

IF 1 Q4 ENGINEERING, MANUFACTURING Journal of Micro and Nano-Manufacturing Pub Date : 2022-06-27 DOI:10.1115/msec2022-85777
Joseph Tang, H. Sezer, N. Ahsan, Hossain Ahmed, S. Kaul
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Abstract

In this paper, maximum stresses from the Direct Metal Laser Sintering (DMLS) process are numerically calculated for each layer using a novel computational model that has been developed to capture the layer-by-layer deposition. The computational domain with all layers is modeled numerically with conduction, while using convection and radiation on the model boundaries. The phase change of the material between liquid and solid states is accounted for and the residual thermal stresses are obtained from the temperature gradient data in conjunction with Hooke’s law. The resulting maximum stress versus time behavior and maximum stress distribution patterns on each layer are complex and do not always match the scanning path. However, there is direct correspondence between the stress distribution and the scanning patterns.
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不同扫描模式下直接金属激光逐层烧结过程中各层最大应力的建模
本文采用一种新的计算模型对直接金属激光烧结(DMLS)过程中的每一层的最大应力进行了数值计算,该模型是为了捕获逐层沉积而开发的。所有层的计算域采用传导法进行数值模拟,在模型边界采用对流和辐射法。考虑了材料的液相和固相变化,并结合胡克定律从温度梯度数据得到了残余热应力。得到的最大应力随时间的变化规律和每层上的最大应力分布模式是复杂的,并不总是与扫描路径相匹配。然而,应力分布与扫描模式之间存在直接对应关系。
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来源期刊
Journal of Micro and Nano-Manufacturing
Journal of Micro and Nano-Manufacturing ENGINEERING, MANUFACTURING-
CiteScore
2.70
自引率
0.00%
发文量
12
期刊介绍: The Journal of Micro and Nano-Manufacturing provides a forum for the rapid dissemination of original theoretical and applied research in the areas of micro- and nano-manufacturing that are related to process innovation, accuracy, and precision, throughput enhancement, material utilization, compact equipment development, environmental and life-cycle analysis, and predictive modeling of manufacturing processes with feature sizes less than one hundred micrometers. Papers addressing special needs in emerging areas, such as biomedical devices, drug manufacturing, water and energy, are also encouraged. Areas of interest including, but not limited to: Unit micro- and nano-manufacturing processes; Hybrid manufacturing processes combining bottom-up and top-down processes; Hybrid manufacturing processes utilizing various energy sources (optical, mechanical, electrical, solar, etc.) to achieve multi-scale features and resolution; High-throughput micro- and nano-manufacturing processes; Equipment development; Predictive modeling and simulation of materials and/or systems enabling point-of-need or scaled-up micro- and nano-manufacturing; Metrology at the micro- and nano-scales over large areas; Sensors and sensor integration; Design algorithms for multi-scale manufacturing; Life cycle analysis; Logistics and material handling related to micro- and nano-manufacturing.
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