Abstract In laser-induced plasma micro-machining (LIPMM), a focused, ultrashort pulsed laser beam creates a highly localized plasma zone within a transparent liquid dielectric. When the beam intensity is greater than the breakdown threshold in the dielectric media, plasma is formed which is then used to ablate the workpiece. This paper aims to facilitate in-situ process monitoring and quality prediction for LIPMM by developing a deep learning model to (1) understand the relationship between acoustic emission data and quality of micro-machining with LIPMM, (2) transfer such understanding across different process parameters, and (3) predict quality accurately by fine-tuning models with a smaller dataset. Experiments and results show that the relationship learned from one process parameter can be transferred to other parameters, requiring lesser data and lesser computational time for training the model. We investigate the feasibility of transfer learning and compare the performance of various transfer learning models: different input features, different CNN structures, and the same structure with different fine-tuned layers. The findings provide insights into how to design effective transfer learning models for manufacturing applications.
{"title":"Transfer Learning For Predictive Quality In Laser-Induced Plasma Micro-Machining","authors":"Mengfei Chen, Rajiv Malhotra, Weihong (Grace) Guo","doi":"10.1115/1.4064010","DOIUrl":"https://doi.org/10.1115/1.4064010","url":null,"abstract":"Abstract In laser-induced plasma micro-machining (LIPMM), a focused, ultrashort pulsed laser beam creates a highly localized plasma zone within a transparent liquid dielectric. When the beam intensity is greater than the breakdown threshold in the dielectric media, plasma is formed which is then used to ablate the workpiece. This paper aims to facilitate in-situ process monitoring and quality prediction for LIPMM by developing a deep learning model to (1) understand the relationship between acoustic emission data and quality of micro-machining with LIPMM, (2) transfer such understanding across different process parameters, and (3) predict quality accurately by fine-tuning models with a smaller dataset. Experiments and results show that the relationship learned from one process parameter can be transferred to other parameters, requiring lesser data and lesser computational time for training the model. We investigate the feasibility of transfer learning and compare the performance of various transfer learning models: different input features, different CNN structures, and the same structure with different fine-tuned layers. The findings provide insights into how to design effective transfer learning models for manufacturing applications.","PeriodicalId":45459,"journal":{"name":"Journal of Micro and Nano-Manufacturing","volume":"47 49","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135432995","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Simultaneous micro and nanoscale etching of silicon on a wafer-scale is nowadays performed using plasma etching techniques. These plasma techniques, however, suffer from low throughput due to Aspect-Ratio Dependent Etch (ARDE) rate, etch lag from changes in feature size, loading effects from increased etch area, and undesirable surface characteristics such as sidewall taper and scalloping, which are particularly problematic at the nanoscale and can affect the etch uniformity. Additionally, the hardware required for plasma etching can be very expensive. A potential alternative, which addresses the above issues with plasma etching is Metal Assisted Chemical Etch (MacEtch). To date, however, an integrated micro and nanoscale MacEtch process, which has uniform and clean (i.e. without nanowire-like defects in microscale areas) etch front has not been presented in the literature. In this work, we present for the first time a feasible process flow for simultaneous micro and nanoscale silicon etching without nanowire-like defects, which we call Integrated Micro- and Nanoscale MacEtch (IMN-MacEtch). Successful etching of silicon features ranging from 100 nm to 100 µm was achieved with etch rates of about 1.8 µm/min in a single step to achieve features with an Aspect Ratio (AR) ~18:1. We thus conclude that the process represents a feasible alternative to current dry etch methods for patterning feature sizes spanning three orders of magnitude.
{"title":"Simultaneous Micro- and Nanoscale Silicon Fabrication by Metal-Assisted Chemical Etch","authors":"Raul Lema Galindo, P. Ajay, S. V. Sreenivasan","doi":"10.1115/1.4062167","DOIUrl":"https://doi.org/10.1115/1.4062167","url":null,"abstract":"\u0000 Simultaneous micro and nanoscale etching of silicon on a wafer-scale is nowadays performed using plasma etching techniques. These plasma techniques, however, suffer from low throughput due to Aspect-Ratio Dependent Etch (ARDE) rate, etch lag from changes in feature size, loading effects from increased etch area, and undesirable surface characteristics such as sidewall taper and scalloping, which are particularly problematic at the nanoscale and can affect the etch uniformity. Additionally, the hardware required for plasma etching can be very expensive. A potential alternative, which addresses the above issues with plasma etching is Metal Assisted Chemical Etch (MacEtch). To date, however, an integrated micro and nanoscale MacEtch process, which has uniform and clean (i.e. without nanowire-like defects in microscale areas) etch front has not been presented in the literature. In this work, we present for the first time a feasible process flow for simultaneous micro and nanoscale silicon etching without nanowire-like defects, which we call Integrated Micro- and Nanoscale MacEtch (IMN-MacEtch). Successful etching of silicon features ranging from 100 nm to 100 µm was achieved with etch rates of about 1.8 µm/min in a single step to achieve features with an Aspect Ratio (AR) ~18:1. We thus conclude that the process represents a feasible alternative to current dry etch methods for patterning feature sizes spanning three orders of magnitude.","PeriodicalId":45459,"journal":{"name":"Journal of Micro and Nano-Manufacturing","volume":"1 1","pages":""},"PeriodicalIF":1.0,"publicationDate":"2023-03-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44345368","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The design and operation of lab-on-a-chip systems that are based on electrical circuits require fluids that are propelled by thermo-electrokinetic forces. On-chip operations including the generation of heat along microchannels and the control of liquid flow are all relevant in the traditional sense. The influence of heat on pseudoplastic fluid flow is demonstrated in this work using electroosmotic (EOF) peristaltic pumping. The fundamental heat-transport equations that govern microchannel applications are developed from theoretical considerations. Explicit equations are presented for pressure gradient, stream functions, heat transfer coefficient, and temperature distribution when long wave length and low Reynolds numbers are taken into account. Analytical solutions employ a regular perturbation approach. Then, Mathematica software is used to solve the resulting equation. Physical quantities are analysed using a variety of parameters. The results are visibly presented for each parameter at the end.
{"title":"Thermodynamic Evaluation of Electroosmotic Peristaltic Pumping for Shear-Thinning Fluid Flow","authors":"S. Noreen, M. Zahra","doi":"10.1115/1.4062168","DOIUrl":"https://doi.org/10.1115/1.4062168","url":null,"abstract":"\u0000 The design and operation of lab-on-a-chip systems that are based on electrical circuits require fluids that are propelled by thermo-electrokinetic forces. On-chip operations including the generation of heat along microchannels and the control of liquid flow are all relevant in the traditional sense. The influence of heat on pseudoplastic fluid flow is demonstrated in this work using electroosmotic (EOF) peristaltic pumping. The fundamental heat-transport equations that govern microchannel applications are developed from theoretical considerations. Explicit equations are presented for pressure gradient, stream functions, heat transfer coefficient, and temperature distribution when long wave length and low Reynolds numbers are taken into account. Analytical solutions employ a regular perturbation approach. Then, Mathematica software is used to solve the resulting equation. Physical quantities are analysed using a variety of parameters. The results are visibly presented for each parameter at the end.","PeriodicalId":45459,"journal":{"name":"Journal of Micro and Nano-Manufacturing","volume":" ","pages":""},"PeriodicalIF":1.0,"publicationDate":"2023-03-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"49614678","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Atomic force microscope (AFM)-based nanopatterning is a cost-effective set of techniques to fabricate nanostructures with arbitrary shapes. However, existing AFM-based nanopatterning approaches have limitations in the patterning resolution and efficiency. Minimum feature size and nanopatterning performance in the mechanical force-induced process are limited by the radius and sharpness of the AFM tip. Electric-field-assisted atomic force microscope (E-AFM) nanolithography can fabricate nanopatterns with features smaller than the tip radius, but it is very challenging to find the appropriate input parameter window because the applicable tip bias range for success nanopatterning in E-AFM process is typically very small. Moreover, the small tip bias range often varies due to the variations in the tip geometry, tip radius, and tip conductive coating thickness, which causes difficult nanopatterning implementation. In this paper, we demonstrate a novel electric-field and mechanical vibration-assisted AFM-based nanofabrication approach, which enables high-resolution (sub-10 nm towards sub-5nm) and high-efficiency nanopatterning processes. The integration of in-plane vibration with the electric field increases the patterning speed, broadens the selectable ranges of applied voltages, and reduces the minimum tip bias required for nanopatterning as compared with E-AFM process, which significantly increases the versatility and capability of AFM-based nanopatterning and effectively avoids the tip damage.
{"title":"Electric-field and Mechanical Vibration-assisted Atomic Force Microscope (AFM)-based Nanopatterning","authors":"Huimin Zhou, Yingchun Jiang, C. Ke, Jia Deng","doi":"10.1115/1.4056731","DOIUrl":"https://doi.org/10.1115/1.4056731","url":null,"abstract":"\u0000 Atomic force microscope (AFM)-based nanopatterning is a cost-effective set of techniques to fabricate nanostructures with arbitrary shapes. However, existing AFM-based nanopatterning approaches have limitations in the patterning resolution and efficiency. Minimum feature size and nanopatterning performance in the mechanical force-induced process are limited by the radius and sharpness of the AFM tip. Electric-field-assisted atomic force microscope (E-AFM) nanolithography can fabricate nanopatterns with features smaller than the tip radius, but it is very challenging to find the appropriate input parameter window because the applicable tip bias range for success nanopatterning in E-AFM process is typically very small. Moreover, the small tip bias range often varies due to the variations in the tip geometry, tip radius, and tip conductive coating thickness, which causes difficult nanopatterning implementation. In this paper, we demonstrate a novel electric-field and mechanical vibration-assisted AFM-based nanofabrication approach, which enables high-resolution (sub-10 nm towards sub-5nm) and high-efficiency nanopatterning processes. The integration of in-plane vibration with the electric field increases the patterning speed, broadens the selectable ranges of applied voltages, and reduces the minimum tip bias required for nanopatterning as compared with E-AFM process, which significantly increases the versatility and capability of AFM-based nanopatterning and effectively avoids the tip damage.","PeriodicalId":45459,"journal":{"name":"Journal of Micro and Nano-Manufacturing","volume":" ","pages":""},"PeriodicalIF":1.0,"publicationDate":"2023-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44753173","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
B. Black, S. Chockalingam, Md. Didarul Islam, Sipan Liu, Himendra Perera, Saad A Khan, J. Ryu
Bioinspired, micro/nano-textured surfaces have a variety of applications including superhydrophobicity, self-cleaning, anti-icing, anti-biofouling, and drag reduction. In this paper, a template-free and scalable roll coating process is studied for fabrication of micro/nano-scale topographies surfaces. These micro/nano-scale structures are generated with viscoelastic polymer nanocomposites and derived by controlling ribbing instabilities in forward roll coating. The relationship between process conditions and surface topography is studied in terms of shear rate, capillary number, and surface roughness parameters (e.g., Wenzel factor and the density of peaks). For a given shear rate, the sample roughness increased with a higher capillary number until a threshold point. Similarly, for a given capillary number, the roughness increased up to a threshold range associated with shear rate. The optimum range of the shear rate and the capillary number was found to be 40-60 s-1 and 4.5×105- 6×105, respectively. This resulted in a maximum Wenzel roughness factor of 1.91, a peak density of 3.94×104 (1/mm2), and a water contact angle (WCA)of 128°.
{"title":"Fabrication of Bioinspired Micro/nano-textured Surfaces Through Scalable Roll Coating Manufacturing","authors":"B. Black, S. Chockalingam, Md. Didarul Islam, Sipan Liu, Himendra Perera, Saad A Khan, J. Ryu","doi":"10.1115/1.4056732","DOIUrl":"https://doi.org/10.1115/1.4056732","url":null,"abstract":"\u0000 Bioinspired, micro/nano-textured surfaces have a variety of applications including superhydrophobicity, self-cleaning, anti-icing, anti-biofouling, and drag reduction. In this paper, a template-free and scalable roll coating process is studied for fabrication of micro/nano-scale topographies surfaces. These micro/nano-scale structures are generated with viscoelastic polymer nanocomposites and derived by controlling ribbing instabilities in forward roll coating. The relationship between process conditions and surface topography is studied in terms of shear rate, capillary number, and surface roughness parameters (e.g., Wenzel factor and the density of peaks). For a given shear rate, the sample roughness increased with a higher capillary number until a threshold point. Similarly, for a given capillary number, the roughness increased up to a threshold range associated with shear rate. The optimum range of the shear rate and the capillary number was found to be 40-60 s-1 and 4.5×105- 6×105, respectively. This resulted in a maximum Wenzel roughness factor of 1.91, a peak density of 3.94×104 (1/mm2), and a water contact angle (WCA)of 128°.","PeriodicalId":45459,"journal":{"name":"Journal of Micro and Nano-Manufacturing","volume":" ","pages":""},"PeriodicalIF":1.0,"publicationDate":"2023-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45384847","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-12-01Epub Date: 2023-10-09DOI: 10.1115/1.4063179
Dongyang Yi, Yao Yao, Yi Wang, Lei Chen
Electrophysiological recording and stimulation of neuron activities are important for us to understand the function and dysfunction of the nervous system. To record/stimulate neuron activities as voltage fluctuation extracellularly, microelectrode array (MEA) implants are a promising tool to provide high temporal and spatial resolution for neuroscience studies and medical treatments. The design configuration and recording capabilities of the MEAs have evolved dramatically since their invention and manufacturing process development has been a key driving force for such advancement. Over the past decade, since the White House Brain Research Through Advancing Innovative Neurotechnologies (BRAIN) Initiative launched in 2013, advanced manufacturing processes have enabled advanced MEAs with increased channel count and density, access to more brain areas, more reliable chronic performance, as well as minimal invasiveness and tissue reaction. In this state-of-the-art review paper, three major types of electrophysiological recording MEAs widely used nowadays, namely, microwire-based, silicon-based, and flexible MEAs are introduced and discussed. Conventional design and manufacturing processes and materials used for each type are elaborated, followed by a review of further development and recent advances in manufacturing technologies and the enabling new designs and capabilities. The review concludes with a discussion on potential future directions of manufacturing process development to enable the long-term goal of large-scale high-density brain-wide chronic recordings in freely moving animals.
{"title":"Manufacturing Processes of Implantable Microelectrode Array for In Vivo Neural Electrophysiological Recordings and Stimulation: A State-Of-the-Art Review.","authors":"Dongyang Yi, Yao Yao, Yi Wang, Lei Chen","doi":"10.1115/1.4063179","DOIUrl":"10.1115/1.4063179","url":null,"abstract":"<p><p>Electrophysiological recording and stimulation of neuron activities are important for us to understand the function and dysfunction of the nervous system. To record/stimulate neuron activities as voltage fluctuation extracellularly, microelectrode array (MEA) implants are a promising tool to provide high temporal and spatial resolution for neuroscience studies and medical treatments. The design configuration and recording capabilities of the MEAs have evolved dramatically since their invention and manufacturing process development has been a key driving force for such advancement. Over the past decade, since the White House Brain Research Through Advancing Innovative Neurotechnologies (BRAIN) Initiative launched in 2013, advanced manufacturing processes have enabled advanced MEAs with increased channel count and density, access to more brain areas, more reliable chronic performance, as well as minimal invasiveness and tissue reaction. In this state-of-the-art review paper, three major types of electrophysiological recording MEAs widely used nowadays, namely, microwire-based, silicon-based, and flexible MEAs are introduced and discussed. Conventional design and manufacturing processes and materials used for each type are elaborated, followed by a review of further development and recent advances in manufacturing technologies and the enabling new designs and capabilities. The review concludes with a discussion on potential future directions of manufacturing process development to enable the long-term goal of large-scale high-density brain-wide chronic recordings in freely moving animals.</p>","PeriodicalId":45459,"journal":{"name":"Journal of Micro and Nano-Manufacturing","volume":"10 4","pages":"041001"},"PeriodicalIF":1.0,"publicationDate":"2022-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10583290/pdf/jmnm-23-1024_041001.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"49683377","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Chatter free machining is necessary in micromilling to avoid the catastrophic failure of micro-end mill. The accuracy of the prediction of chatter free machining condition in high speed micromilling has been improved in present work by including speed varying micro-end mill dynamics. An optimum design of exponential window has been devised to remove the unwanted spindle dynamics from the displacement signal to construct the speed dependent frequency response function (FRF) of micro-end mill. The stiffness of the micro-end mill has been found to be increasing with increase in spindle speed and the natural frequency of the micro-end mill has been found to be changing with change in spindle speeds. The cutting velocity-chip load dependent cutting coefficients has been included to predict the stability using Nyquist criterion. The predicted stability lobe with speed varying micro-end mill dynamics has increased chatter free depth of cut significantly compared to the chatter free depth of cut predicted with static micro-end mill dynamics. The increase in depth of cut with speed varying dynamics has been found to be 28% at 20000 rpm, 150% at 52000 rpm and 250% at 70000 rpm. A critical value of acceleration of the workpiece has been identified for chatter onset detection and it has been validated with machined surface image analysis. The magnitude of acceleration in both feed and normal to feed direction has been characterized to analyze the effect of spindle speed and depth of cut on the vibration of workpiece.
{"title":"The Effect of Speed-Varying Micro-Cutting Tool Dynamics on Stability During High Speed Micromilling of Ti6Al4V","authors":"G. S., B. Panigrahi, Kundan K. Singh","doi":"10.1115/1.4056215","DOIUrl":"https://doi.org/10.1115/1.4056215","url":null,"abstract":"\u0000 Chatter free machining is necessary in micromilling to avoid the catastrophic failure of micro-end mill. The accuracy of the prediction of chatter free machining condition in high speed micromilling has been improved in present work by including speed varying micro-end mill dynamics. An optimum design of exponential window has been devised to remove the unwanted spindle dynamics from the displacement signal to construct the speed dependent frequency response function (FRF) of micro-end mill. The stiffness of the micro-end mill has been found to be increasing with increase in spindle speed and the natural frequency of the micro-end mill has been found to be changing with change in spindle speeds. The cutting velocity-chip load dependent cutting coefficients has been included to predict the stability using Nyquist criterion. The predicted stability lobe with speed varying micro-end mill dynamics has increased chatter free depth of cut significantly compared to the chatter free depth of cut predicted with static micro-end mill dynamics. The increase in depth of cut with speed varying dynamics has been found to be 28% at 20000 rpm, 150% at 52000 rpm and 250% at 70000 rpm. A critical value of acceleration of the workpiece has been identified for chatter onset detection and it has been validated with machined surface image analysis. The magnitude of acceleration in both feed and normal to feed direction has been characterized to analyze the effect of spindle speed and depth of cut on the vibration of workpiece.","PeriodicalId":45459,"journal":{"name":"Journal of Micro and Nano-Manufacturing","volume":"124 9","pages":""},"PeriodicalIF":1.0,"publicationDate":"2022-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"41331114","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The paper primarily explores the suitability of using Abrasive jet machining (AJM) in fabricating micro-channels on Ti-6Al-4V ELI alloy. The work evaluates the micro-channels generated using process parameters such as air pressure, feed rate, and standoff distance and their effect on channel geometries like width, depth, surface roughness, and topography. Since Ti-6Al-4V ELI alloy is commonly used in bio-implants, the contact angle and surface free energy of generated micro-channels is measured using the sessile drop technique and Chibowski approach, respectively to assess the benefits of creating such features using AJM, which can have probable applications in the medical field. The result indicates that AJM can produce hydrophilic micro-channels with nano-level surface roughness without the effects of heat-affected zone (HAZ), resolidification, burrs, and particle embedment.
{"title":"Fabrication of Micro-channels On Biomaterial Ti-6Al-4V ELI Using Micro Abrasive Jet Machining","authors":"Anu Tomy, S. Somashekhar","doi":"10.1115/1.4055991","DOIUrl":"https://doi.org/10.1115/1.4055991","url":null,"abstract":"\u0000 The paper primarily explores the suitability of using Abrasive jet machining (AJM) in fabricating micro-channels on Ti-6Al-4V ELI alloy. The work evaluates the micro-channels generated using process parameters such as air pressure, feed rate, and standoff distance and their effect on channel geometries like width, depth, surface roughness, and topography. Since Ti-6Al-4V ELI alloy is commonly used in bio-implants, the contact angle and surface free energy of generated micro-channels is measured using the sessile drop technique and Chibowski approach, respectively to assess the benefits of creating such features using AJM, which can have probable applications in the medical field. The result indicates that AJM can produce hydrophilic micro-channels with nano-level surface roughness without the effects of heat-affected zone (HAZ), resolidification, burrs, and particle embedment.","PeriodicalId":45459,"journal":{"name":"Journal of Micro and Nano-Manufacturing","volume":" ","pages":""},"PeriodicalIF":1.0,"publicationDate":"2022-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46107868","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Crystal Barrera, P. Ajay, Akhila Mallavarapu, Mark Hrdy, S. V. Sreenivasan
Metal Assisted Chemical Etching (MacEtch) of silicon shows reliable vertical anisotropic wet etching only in single-crystal silicon, which limits its applications to a small number of devices. This work extends the capabilities of MacEtch to polysilicon which has potential to enable high-volume and cost-sensitive applications such as optical metasurfaces, anodes for high capacity and flexible batteries, electrostatic supercapacitors, sensors, nanofluidic deterministic lateral displacement devices, etc. This work presents a MacEtch of polysilicon that produces nanostructure arrays with sub-50nm resolution and anisotropic profile. The three demonstrated structures are pillars of 5:1 aspect ratio and 50nm spacing for comparison to single crystal silicon MacEtch literature, pillars of 30nm spacing and a diamond pillar array with sharp corners to establish resolution limits of polysilicon MacEtch.
{"title":"Metal Assisted Chemical Etch of Polycrystalline Silicon","authors":"Crystal Barrera, P. Ajay, Akhila Mallavarapu, Mark Hrdy, S. V. Sreenivasan","doi":"10.1115/1.4055401","DOIUrl":"https://doi.org/10.1115/1.4055401","url":null,"abstract":"\u0000 Metal Assisted Chemical Etching (MacEtch) of silicon shows reliable vertical anisotropic wet etching only in single-crystal silicon, which limits its applications to a small number of devices. This work extends the capabilities of MacEtch to polysilicon which has potential to enable high-volume and cost-sensitive applications such as optical metasurfaces, anodes for high capacity and flexible batteries, electrostatic supercapacitors, sensors, nanofluidic deterministic lateral displacement devices, etc. This work presents a MacEtch of polysilicon that produces nanostructure arrays with sub-50nm resolution and anisotropic profile. The three demonstrated structures are pillars of 5:1 aspect ratio and 50nm spacing for comparison to single crystal silicon MacEtch literature, pillars of 30nm spacing and a diamond pillar array with sharp corners to establish resolution limits of polysilicon MacEtch.","PeriodicalId":45459,"journal":{"name":"Journal of Micro and Nano-Manufacturing","volume":" ","pages":""},"PeriodicalIF":1.0,"publicationDate":"2022-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43964013","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
During the micro electrical discharge machining (micro EDM) process, the dielectric property of narrow interelectrode gap is transiently changing. With the hysteretic servo motion of spindle, the effective discharge ratio (EDR) between electrodes is low. In this research, a pulsed power supply superposed with the radio-frequency (RF) oscillating wave of controllable frequency and amplitude is proposed in order to induce interelectrode continuous discharge, so that the machining efficiency and accuracy are improved simultaneously. The experimental results of micro-hole machining shows that under the oscillating frequency of 160 MHz and amplitude of ±10 V, the machining efficiency is increased by 35%, the tool electrode wear rate (TWR) remains almost unchanged, and the taper error of micro-hole is reduced by 43%. Furthermore, the process of relatively enlarging discharge gap range and increasing number of discharges after superposition is discussed, and the proper superposed oscillating amplitude is identified.
{"title":"Pulsed Power Supply Superposed with RF Oscillating Wave for the Improvement of Micro EDM Process","authors":"Peiyao Cao, H. Tong, Yong Li","doi":"10.1115/1.4054974","DOIUrl":"https://doi.org/10.1115/1.4054974","url":null,"abstract":"\u0000 During the micro electrical discharge machining (micro EDM) process, the dielectric property of narrow interelectrode gap is transiently changing. With the hysteretic servo motion of spindle, the effective discharge ratio (EDR) between electrodes is low. In this research, a pulsed power supply superposed with the radio-frequency (RF) oscillating wave of controllable frequency and amplitude is proposed in order to induce interelectrode continuous discharge, so that the machining efficiency and accuracy are improved simultaneously. The experimental results of micro-hole machining shows that under the oscillating frequency of 160 MHz and amplitude of ±10 V, the machining efficiency is increased by 35%, the tool electrode wear rate (TWR) remains almost unchanged, and the taper error of micro-hole is reduced by 43%. Furthermore, the process of relatively enlarging discharge gap range and increasing number of discharges after superposition is discussed, and the proper superposed oscillating amplitude is identified.","PeriodicalId":45459,"journal":{"name":"Journal of Micro and Nano-Manufacturing","volume":" ","pages":""},"PeriodicalIF":1.0,"publicationDate":"2022-07-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44109714","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}