Effects of impurities and grain size on welding performance of T3 copper

Abstract

X-ray fluorescence analyze, the milliohm meter and X-ray energy dispersive spectrometer were used to investigate the impurities and electric resistance of the copper wire. By the polishing and corrosion testing, the different grain sizes were observed by scanning electron microscopy. The impurities can effect on the hardness and electrical conductivity of the copper wire. The grain size also affects the hardness and plasticity. Consequently, the difference in impurities and grain sizes lead to the different welding performance.