In situ Preparation of Aramid-MWCNT Nano-composites: Morphology, Thermal Mechanical and Dielectric Properties

Z. Ahmad, F. Al-Sagheer, A. Bumajdad, Jessy Shiju
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Abstract

In situ polymerization technique was used to link chemically the amine-terminated high molecular weight aramid chains with acid-functionalized MWCNTs. The The X-ray photoelectron spectroscopy (XPS) was used to study the chemical linkage between aramid chains and MWCNTs and the composite morphology was investigated by scanning electron microscopy. Dynamic mechanical analysis (DMA) showed a higher increase in the storage modulus. The temperature involving α-relaxations on MWCNTs loading was found higher in comparison to the system where pristine MWCNTs were used. Iinterfacial interactions between the matrix and MWCNTs including hydrogen bonding, π–π stacking and chemical bonding are considered the key parameters responsible and the chemical bonding of the MWCNTs with the matrix resulted in better dispersion of CNTs and the higher visco-elastic properties. The maximum glass transition and the thermal decomposition temperature of these composites respectively were observed around 346°C and 533°C. The inclusion of pristine CNTs increased the electric conductivity of the aramid films with a minimum threshold value at the loading of 1.67 vol.%. Such mechanically strong and thermally stable aramid composites are suitable for many applications including high performance materials for electromagnetic shielding and radar absorption.
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芳纶- mwcnt纳米复合材料的原位制备:形貌、热力学和介电性能
采用原位聚合技术将胺端高分子量芳纶链与酸功能化的MWCNTs进行化学连接。利用x射线光电子能谱(XPS)研究了芳纶链与MWCNTs之间的化学连接,并用扫描电镜研究了复合材料的形貌。动态力学分析(DMA)显示出较高的存储模量增加。与使用原始MWCNTs的系统相比,加载MWCNTs时涉及α-弛豫的温度更高。基体与MWCNTs之间的界面相互作用(包括氢键、π -π堆叠和化学键)被认为是关键参数,MWCNTs与基体的化学键形成了更好的碳纳米管分散性和更高的粘弹性。复合材料的最大玻璃化转变温度在346℃左右,最大热分解温度在533℃左右。原始碳纳米管的加入增加了芳纶薄膜的电导率,最小阈值为1.67 vol.%。这种机械强度和热稳定性的芳纶复合材料适用于许多应用,包括用于电磁屏蔽和雷达吸收的高性能材料。
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