Haitao Zhang, J. Duchaine, F. Torregrosa, Linjie Liu, B. Hollander, U. Breuer, S. Mantl, Qing-Tai Zhao
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引用次数: 3
Abstract
We present in this paper high quality thin NiSi contacts on Si for the 16nm node using pre-silicidation CF4 Plasma Immersion Ion Implantation (PIII) The thermal stability, the layer uniformity and the interface roughness of thin NiSi layers are improved by CF4 PIII, which is assumed to be caused by segregation of C, F atoms at the grain boundaries and at the NiSi/Si interface. The Schottky barrier height of NiSi/p-Si is also lowered by CF4 plasma, thus a lower contact resistance on p+ doped Si is expected.
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