Influence of Residual Transverse Magnetic Field on Sheath Expansion Process in Vacuum Interruption

Feiliang Hu, Shaoweihua Liu, Feng Liu, Hui Ma, Zhiyuan Liu, Yingsan Geng, Jing Peng, Xi Chen
{"title":"Influence of Residual Transverse Magnetic Field on Sheath Expansion Process in Vacuum Interruption","authors":"Feiliang Hu, Shaoweihua Liu, Feng Liu, Hui Ma, Zhiyuan Liu, Yingsan Geng, Jing Peng, Xi Chen","doi":"10.1109/ICHVE49031.2020.9279628","DOIUrl":null,"url":null,"abstract":"The objective of this paper is to quantitatively determine the influence of the residual transverse magnetic field (TMF) on sheath expansion process after current interruption in vacuum. A two-dimensional (2D) particle-in-cell (PIC) model was adopted. The investigated residual TMF ranged from 0 to 300 mT. The simulation results showed that except an ion sheath existing in the sheath expansion period, there appeared an electron sheath, which is formed under the influence of the TMF. Moreover, when there is no residual TMF, the voltage drop mainly applied on the ion sheath. With the application of residual TMF, the voltage drop mainly applied on the electron sheath. Finally, residual TMF has a remarkable blows effect on the electrons. Few electrons diffused to the area between anode and shield under the influence of the residual TMF.","PeriodicalId":6763,"journal":{"name":"2020 IEEE International Conference on High Voltage Engineering and Application (ICHVE)","volume":"48 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2020-09-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE International Conference on High Voltage Engineering and Application (ICHVE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICHVE49031.2020.9279628","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

The objective of this paper is to quantitatively determine the influence of the residual transverse magnetic field (TMF) on sheath expansion process after current interruption in vacuum. A two-dimensional (2D) particle-in-cell (PIC) model was adopted. The investigated residual TMF ranged from 0 to 300 mT. The simulation results showed that except an ion sheath existing in the sheath expansion period, there appeared an electron sheath, which is formed under the influence of the TMF. Moreover, when there is no residual TMF, the voltage drop mainly applied on the ion sheath. With the application of residual TMF, the voltage drop mainly applied on the electron sheath. Finally, residual TMF has a remarkable blows effect on the electrons. Few electrons diffused to the area between anode and shield under the influence of the residual TMF.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
真空中断中残余横向磁场对护套膨胀过程的影响
本文的目的是定量确定真空中电流中断后残余横向磁场(TMF)对鞘层膨胀过程的影响。采用二维(2D)细胞内粒子(PIC)模型。所研究的残余TMF范围为0 ~ 300 mT。模拟结果表明,在鞘层膨胀期除了存在离子鞘层外,还存在电子鞘层,这是在TMF的影响下形成的。此外,当没有残余TMF时,电压降主要作用在离子鞘上。在残余TMF的作用下,电压降主要作用在电子护套上。最后,残余TMF对电子有显著的冲击效应。在残余TMF的影响下,很少有电子扩散到阳极和屏蔽之间的区域。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Excellent electrical properties of zinc-oxide varistors by tailoring sintering process for optimizing line-arrester configuration Research of Short Air Gap Flashover Characteristic with Water Droplets Pattern Recognition of Development Stage of Creepage Discharge of Oil-Paper Insulation under AC-DC Combined Voltage based on OS-ELM Study on the PD Creeping Discharge Development Process Induced by Metallic Particles in GIS A Novel Fabry-Perot Sensor Mounted on External Surface of Transformers for Partial Discharge Detection
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1