On the design of package-integrated RF high-power amplifiers

Abstract

For wireless infrastructure applications, package-integrated power amplifiers are an appealing approach to achieve improved RF performance in terms of bandwidth and efficiency, as well as lower memory effects, form-factors and cost. This work discusses the specific design and implementation aspects for low-cost package-integrated PAs. Special attention is given to implementation deviations and tolerances when using bondwires. As case study, two class-E RF PA implementations with different bondwire-based output matching networks are evaluated for their predicted physics-based performance versus measured data. The high performance of these PAs shows the potential of these techniques for realizing ultra-compact next generation PA modules.