Low Temperature Solder Attach of SnAgCu Bumped Components for a Flexible Hybrid Electronics Based Medical Monitor

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) Pub Date : 2018-05-01 DOI:10.1109/ECTC.2018.00145

T. Alghoul, M. Yadav, S. Thekkut, R. Sivasubramony, C. M. Greene, M. Poliks, P. Borgesen, L. Wentlent, M. Meilunas, N. Stoffel, D. Shaddock, L. Yin

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Abstract

The use of commercial electronics components with Tin-Silver-Copper solder bumps normally calls for relatively high cost substrates, posing a challenge for disposable (inexpensive) products. The present effort addresses the feasibility of reducing reflow temperatures through the use of a eutectic Tin-Bismuth solder paste for products that do not have to survive significant thermal cycling. A set of experiments was conducted to assess the effects of paste volume and reflow profiles on solder joint strength and low cycle fatigue resistance. Both strength and fatigue resistance tended to decrease with decreasing peak temperature and paste volume, but indications are that performances comparable to those of conventionally reflowed Tin-Silver-Copper solder joints can be achieved even with laser reflow and a peak temperature as low as 160C. This offers promise for the use of low cost substrates such as PET.

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柔性混合电子医疗监视器中SnAgCu碰撞元件的低温焊料连接

使用带有锡银铜焊料凸起的商业电子元件通常需要相对高成本的基板，这对一次性(廉价)产品提出了挑战。目前的努力解决了通过使用共晶锡铋锡锡膏来降低回流温度的可行性，这种锡铋锡膏不需要经历显著的热循环。通过试验研究了膏体体积和回流形状对焊点强度和抗低周疲劳性能的影响。随着峰值温度和膏体体积的降低，强度和抗疲劳性能都趋于降低，但有迹象表明，即使采用激光回流焊，峰值温度低至160℃，也可以达到与传统回流焊锡银铜焊点相当的性能。这为使用低成本基材(如PET)提供了希望。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

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