Samuel Sofela, Hammad Younes, M. Jelbuldina, I. Saadat, A. Al Ghaferi
{"title":"Carbon nanomaterials based TSVs for dual sensing and vertical interconnect application","authors":"Samuel Sofela, Hammad Younes, M. Jelbuldina, I. Saadat, A. Al Ghaferi","doi":"10.1109/IITC-MAM.2015.7325669","DOIUrl":null,"url":null,"abstract":"We discuss fabrication and characterization of TSVs filled with carbon nano-materials (CNM) for dual function of sensing and vertical interconnect for hostile environment applications (Corrosive High Temperature and Pressure). Nano-composites, made by functionalization of CNTs were integrated using dispersion in epoxy resin and inkjet techniques to fill up the TSVs and provide sensing surface. The results reveal ability for the nano-composite to fill vias with electrical conductivity path and sensing established through the wafer backside.","PeriodicalId":6514,"journal":{"name":"2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)","volume":"11 1","pages":"289-292"},"PeriodicalIF":0.0000,"publicationDate":"2015-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC-MAM.2015.7325669","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
We discuss fabrication and characterization of TSVs filled with carbon nano-materials (CNM) for dual function of sensing and vertical interconnect for hostile environment applications (Corrosive High Temperature and Pressure). Nano-composites, made by functionalization of CNTs were integrated using dispersion in epoxy resin and inkjet techniques to fill up the TSVs and provide sensing surface. The results reveal ability for the nano-composite to fill vias with electrical conductivity path and sensing established through the wafer backside.
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