{"title":"Analysis of board level vibration reliability of PoP structure with underfill material","authors":"J. Xia, Guoyuan Li, Bin Zhou","doi":"10.1109/ICEPT.2016.7583085","DOIUrl":null,"url":null,"abstract":"The board level vibration reliability of the Package-on-Package (PoP) structure with different underfill types was investigated by finite element method (FEM). Underfill methods used in this study were the full-filled method, the corer-bonded method and the edge-bonded method. Results show that all of them can obviously improve the reliability of PoP structure in random vibration environment. The stress level of the solder joint significantly decreases by the application of underfill materials in the bottom package body of PoP structure. In addition, the location of critical solder joint is different with different underfill types.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"47 1","pages":"37-42"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2016.7583085","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
The board level vibration reliability of the Package-on-Package (PoP) structure with different underfill types was investigated by finite element method (FEM). Underfill methods used in this study were the full-filled method, the corer-bonded method and the edge-bonded method. Results show that all of them can obviously improve the reliability of PoP structure in random vibration environment. The stress level of the solder joint significantly decreases by the application of underfill materials in the bottom package body of PoP structure. In addition, the location of critical solder joint is different with different underfill types.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
