2D Charge Density Probing at Aluminum / SiNx Interface: a Sub-micrometric Investigation by Kelvin Probe Force Microscopy

C. Djaou, C. Villeneuve-Faure, L. Boudou, K. Makasheva, G. Teyssèdre
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Abstract

Charge injection and transport mechanisms occurring at metal/dielectric interface may strongly impact devices performance and reliability. However, these phenomena remain partially understood, mainly due to the lack of adapted characterization tools. In this paper, we propose an investigation of the charging behavior at the Al/SiNx interface using Kelvin Probe Force Microscopy (KPFM). Indeed, KPFM measurements permit to probe space charge density with a sub micrometric resolution. Results presented here emphasize that electrons and holes are injected and trapped close to cathode and anode, respectively. The charge clouds remain stacked to the interface $(2-3 \mu \mathrm{m})$. Moreover, the amount of injected charges increases with the applied bias. The injected electrons and holes follow the same dissipation mechanism in time after bias removal.
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铝/ SiNx界面二维电荷密度探测:开尔文探针力显微镜亚微米研究
发生在金属/介质界面的电荷注入和输运机制对器件的性能和可靠性有很大影响。然而,这些现象仍然是部分理解,主要是由于缺乏适应的表征工具。本文采用开尔文探针力显微镜(KPFM)研究了Al/SiNx界面的充电行为。事实上,KPFM测量允许以亚微米分辨率探测空间电荷密度。本文的结果强调电子和空穴分别在靠近阴极和阳极的地方被注入和捕获。电荷云仍然堆积在接口$(2-3 \mu \mathrm{m})$上。此外,注入电荷量随着施加偏压的增加而增加。消除偏压后,注入的电子和空穴在时间上遵循相同的耗散机制。
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