{"title":"Capacitance-Voltage Investigation of HfO2/Al2O3 Bilayered High-k Dielectrics on Si Nanomembrane","authors":"Chen Liu, Zhuofan Wang, Yuming Zhang, Hongliang Lu, J. Zhao, Yimen Zhang, Lixin Guo","doi":"10.1109/IFETC.2018.8583845","DOIUrl":null,"url":null,"abstract":"As essential building blocks for thin film transistors (TFTs), the metal-oxide-semiconductor (MOS) structure will be fundamentally important for understanding the effect of mechanical bending on TFTs. In this work, HfO2/Al2O3 high-k dielectric bilayers are deposited on Si nanomembranes (NM) by plasma-enhanced atomic layer deposition (PEALD), thus achieving vertical structured flexible MOS capacitors based on such composite gate stack on plastic substrates. Devices demonstrate outstanding capacitance-voltage (C-V) characteristics with nearly no hysteresis voltage, a suppressed stretch-out effect and low frequency dispersion, highlighting HfO2/Al2O3 stacked films as a promising dielectric alternative for high performance bendable and stretchable electronics.","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"4 1","pages":"1-2"},"PeriodicalIF":0.0000,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 International Flexible Electronics Technology Conference (IFETC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IFETC.2018.8583845","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
As essential building blocks for thin film transistors (TFTs), the metal-oxide-semiconductor (MOS) structure will be fundamentally important for understanding the effect of mechanical bending on TFTs. In this work, HfO2/Al2O3 high-k dielectric bilayers are deposited on Si nanomembranes (NM) by plasma-enhanced atomic layer deposition (PEALD), thus achieving vertical structured flexible MOS capacitors based on such composite gate stack on plastic substrates. Devices demonstrate outstanding capacitance-voltage (C-V) characteristics with nearly no hysteresis voltage, a suppressed stretch-out effect and low frequency dispersion, highlighting HfO2/Al2O3 stacked films as a promising dielectric alternative for high performance bendable and stretchable electronics.