{"title":"Fluidic Self-Assembly Transfer Technology for Micro-Led Display","authors":"Seongkyu Cho, Daewon Lee, Sunghoon Kwon","doi":"10.1109/TRANSDUCERS.2019.8808352","DOIUrl":null,"url":null,"abstract":"In this paper, we present a demonstration of high yield Fluidic Self-Assembly (FSA) technology to transfer gallium nitride (GaN) microchips which can be used for Micro-LED display. The low melting point alloy on the substrate and the metal electrode of the chip were assembled in heated solution by a simple shaking motion. More than 19,000 blue GaN microchips with 45um in diameter were precisely assembled at 99.90% yield within 1 min. At the chip sizes below 50um, this dramatic improvement in assembly yield was achieved by using a new assembly solution and chip designs. This low cost and fast demonstration has proven that FSA is a suitable mass transfer technology which is applicable to Micro-LED display after some further development.","PeriodicalId":6672,"journal":{"name":"2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)","volume":"289 1","pages":"402-404"},"PeriodicalIF":0.0000,"publicationDate":"2019-06-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TRANSDUCERS.2019.8808352","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
In this paper, we present a demonstration of high yield Fluidic Self-Assembly (FSA) technology to transfer gallium nitride (GaN) microchips which can be used for Micro-LED display. The low melting point alloy on the substrate and the metal electrode of the chip were assembled in heated solution by a simple shaking motion. More than 19,000 blue GaN microchips with 45um in diameter were precisely assembled at 99.90% yield within 1 min. At the chip sizes below 50um, this dramatic improvement in assembly yield was achieved by using a new assembly solution and chip designs. This low cost and fast demonstration has proven that FSA is a suitable mass transfer technology which is applicable to Micro-LED display after some further development.
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