Low-cost, single-step hybrid bond/barrier films for Cu bondlines in advanced packaging

Abstract

The presence of weak Cu-oxides has detrimental implications for the adhesion, moisture sensitivity, stress-and electro-migration of Cu bondlines in advanced packaging, often leading to premature device failure. We report on a novel, low-cost, single-step sol-gel synthetic route capable of reducing the weak Cu-oxide while simultaneously depositing a high-performance hybrid film, which acts both as an adhesion layer at the Cu/epoxy interface, as well as potentially a barrier film that prevents moisture degradation and Cu stress- and electro-migration.