Monolithic 3D (M3D) reconfigurable logic applications using extremely-low-power electron devices

W. Choi
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Abstract

CMOS and nano-electromechanical (NEM) hybrid reconfigurable logic (RL) circuits are implemented by using monolithic three-dimensional (M3D) integration process. Their operation and feasibility are discussed based on simulation and experimental results.
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使用极低功耗电子器件的单片3D (M3D)可重构逻辑应用
采用单片三维(M3D)集成工艺实现了CMOS和纳米机电(NEM)混合可重构逻辑(RL)电路。根据仿真和实验结果,讨论了其可操作性和可行性。
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