An 80×60 range image sensor based on 10µm 50MHz lock-in pixels in 0.18µm CMOS

D. Stoppa, N. Massari, L. Pancheri, M. Malfatti, M. Perenzoni, L. Gonzo
{"title":"An 80×60 range image sensor based on 10µm 50MHz lock-in pixels in 0.18µm CMOS","authors":"D. Stoppa, N. Massari, L. Pancheri, M. Malfatti, M. Perenzoni, L. Gonzo","doi":"10.1109/ISSCC.2010.5433980","DOIUrl":null,"url":null,"abstract":"Because we are living in a three-dimensional world, the usual intensity map provided by standard digital cameras is often not sufficient to build the sophisticated models required by systems capable of analyzing and interpreting their environment. A three-dimensional (3D) image sensor has great potential for improvement in many areas like ambient-assisted living, virtual reality, gaming, security and surveillance, etc., because it significantly increases the robustness of object classification and avoids time-consuming post-processing steps. Although the first commercial products are now available on the market, one of the main barriers to mass deployment of such 3D vision tools is the large pixel dimension, which ultimately reduces the sensor resolution and increases costs.","PeriodicalId":6418,"journal":{"name":"2010 IEEE International Solid-State Circuits Conference - (ISSCC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2010-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"29","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE International Solid-State Circuits Conference - (ISSCC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.2010.5433980","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 29

Abstract

Because we are living in a three-dimensional world, the usual intensity map provided by standard digital cameras is often not sufficient to build the sophisticated models required by systems capable of analyzing and interpreting their environment. A three-dimensional (3D) image sensor has great potential for improvement in many areas like ambient-assisted living, virtual reality, gaming, security and surveillance, etc., because it significantly increases the robustness of object classification and avoids time-consuming post-processing steps. Although the first commercial products are now available on the market, one of the main barriers to mass deployment of such 3D vision tools is the large pixel dimension, which ultimately reduces the sensor resolution and increases costs.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
基于0.18µm CMOS中的10µm 50MHz锁定像素的80×60距离图像传感器
因为我们生活在一个三维世界中,标准数码相机提供的通常的强度图往往不足以建立分析和解释其环境的系统所需的复杂模型。三维(3D)图像传感器在环境辅助生活、虚拟现实、游戏、安全和监控等许多领域具有巨大的改进潜力,因为它显著提高了目标分类的鲁棒性,避免了耗时的后处理步骤。虽然第一批商业产品现已上市,但大规模部署此类3D视觉工具的主要障碍之一是大像素尺寸,这最终降低了传感器分辨率并增加了成本。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
An 8.5Gb/s CMOS OEIC with on-chip photodiode for short-distance optical communications A 4.5mW/Gb/s 6.4Gb/s 22+1-lane source-synchronous link rx core with optional cleanup PLL in 65nm CMOS A 76dBΩ 1.7GHz 0.18µm CMOS tunable transimpedance amplifier using broadband current pre-amplifier for high frequency lateral micromechanical oscillators A fully integrated 77GHz FMCW radar system in 65nm CMOS A timing controlled AC-DC converter for biomedical implants
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1