{"title":"The Simulation Study on Internal Stress in Multilayer Thermistors during Soldering Process","authors":"N. Yu, JuSong Kim, Yong Li, S. C. Pak","doi":"10.1016/J.SSEL.2020.12.003","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":101175,"journal":{"name":"Solid State Electronics Letters","volume":"34 1","pages":"124-128"},"PeriodicalIF":0.0000,"publicationDate":"2020-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Solid State Electronics Letters","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1016/J.SSEL.2020.12.003","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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