Acoustic wave sensing devices and their LTCC packaging

I. Giangu, V. Buiculescu, G. Konstantinidis, K. Szaciłowski, A. Stefanescu, F. Bechtold, K. Pilarczyk, A. Stavrinidis, P. Kwolek, G. Stavrinidis, J. Mech, A. Muller
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引用次数: 5

Abstract

The paper presents the relevant results of manufacturing LTCC packages intended for chip assembly as well as the RF behavior of SAW and FBAR structures used as temperature and, respectively, humidity sensing devices. Packaged SAW-based temperature sensors were characterized in a cryostat set-up, while the packaged FBAR-based humidity sensors were measured in a small enclosure with controlled humidity. Linear behaviour of the frequency shift vs. temperature and, respectively, relative humidity was evidenced.
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声波传感装置及其LTCC封装
本文介绍了制造用于芯片组装的LTCC封装的相关结果,以及分别用作温度和湿度传感装置的SAW和FBAR结构的射频行为。封装的基于saw的温度传感器在低温恒温器中进行了表征,而封装的基于fbar的湿度传感器在湿度可控的小外壳中进行了测量。频移与温度和相对湿度的线性关系得到了证明。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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