Fabrication of Microcolumn Arrays Using Through-Mask Electrochemical Micromachining on the 42CrMo Alloy Steel

Jia Nong Zhou, Zhi Qi Liu, Dongliang Chen, N. Lin, Huanjie Wang
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Abstract

Studies have shown that surface texture can improve lubrication state and reduce friction and wear. The cold pressing process of micro-units can prepare surface textures at low cost, in large quantities, and with high efficiency, but the micro-pillar array mold required for the cold pressing process is difficult to prepare. In this study, the influence of mask electrochemical processing parameters on the height and height uniformity of the micropillar array was studied by orthogonal experiment on the 42CrMo alloy steel. Four main factors are designed in the orthogonal experiment, namely voltage, duty cycle, frequency, and mask spacing, and each factor is set to three levels. The results of the range analysis show that: voltage and duty cycle are positively correlated with the height of the microcolumn, but negatively correlated with uniformity, and when the duty cycle is 50%, the uniformity of the microcolumn decreases sharply; The height and uniformity of the microcolumns increase with the increase of mask spacing. The height of the microcolumn is positively correlated with the frequency, and the uniformity of the microcolumn first increases and then decreases with the increase of frequency. Therefore, in order to meet the height and uniformity requirements at the same time, the grey correlation analysis method was used to obtain the optimal processing parameters: 35 V (voltage), 30% (duty cycle), 300 um (spacing), and 5 kHz (frequency). The average height of the microcolumns prepared by this parameter is 57.632 um and the microcolumn has excellent high uniformity.
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42CrMo合金钢透掩膜电化学微加工制备微柱阵列
研究表明,表面织构可以改善润滑状态,减少摩擦磨损。微单元冷压工艺可以低成本、大批量、高效率地制备表面纹理,但冷压工艺所需的微柱阵模具难以制备。本研究在42CrMo合金钢上,通过正交实验研究了掩膜电化学工艺参数对微柱阵列高度和高度均匀性的影响。在正交实验中设计了电压、占空比、频率和掩模间距四个主要因素,每个因素设置为三个水平。极差分析结果表明:电压和占空比与微柱高度呈正相关,与均匀度呈负相关,当占空比为50%时,微柱均匀度急剧下降;微柱的高度和均匀性随掩模间距的增大而增大。微柱高度与频率呈正相关,微柱均匀度随频率的增加先增大后减小。因此,为了同时满足高度和均匀性要求,采用灰色关联分析方法获得最佳处理参数:35 V(电压)、30%(占空比)、300 um(间距)、5 kHz(频率)。该参数制备的微柱平均高度为57.632 um,微柱均匀性好。
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