Evolutionary Path Planning With Subpath Constraints

J. S. Gyorfi, D. Gamota, S. Mok, J. Szczech, M. Toloo, J. Zhang
{"title":"Evolutionary Path Planning With Subpath Constraints","authors":"J. S. Gyorfi, D. Gamota, S. Mok, J. Szczech, M. Toloo, J. Zhang","doi":"10.1109/TEPM.2010.2046327","DOIUrl":null,"url":null,"abstract":"We develop an evolutionary method of planning paths that are subject to subpath constraints. These constraints can include subpaths that must be incorporated into the solution path, path intersection restrictions, and obstacle avoidance. Our method involves two stages. In the first stage, a global solution is found without consideration of any obstacles. In the second stage, local planning is performed to modify the global path to avoid obstacles. Stage one involves a fixed-length chromosome formulation of a genetic algorithm that utilizes existing operators and a new subpath reversal operator. Stage two involves a graph search process. Our algorithm is applicable to the field of printed electronics where continuous-spray processes are used to deposit electrically functional material onto flexible substrates. These processes give rise to the kinds of subpath constraints we have investigated. We evaluate our algorithm by applying it to a representative problem in the printed electronics field.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"35 1","pages":"143-151"},"PeriodicalIF":0.0000,"publicationDate":"2010-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"18","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electronics Packaging Manufacturing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEPM.2010.2046327","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 18

Abstract

We develop an evolutionary method of planning paths that are subject to subpath constraints. These constraints can include subpaths that must be incorporated into the solution path, path intersection restrictions, and obstacle avoidance. Our method involves two stages. In the first stage, a global solution is found without consideration of any obstacles. In the second stage, local planning is performed to modify the global path to avoid obstacles. Stage one involves a fixed-length chromosome formulation of a genetic algorithm that utilizes existing operators and a new subpath reversal operator. Stage two involves a graph search process. Our algorithm is applicable to the field of printed electronics where continuous-spray processes are used to deposit electrically functional material onto flexible substrates. These processes give rise to the kinds of subpath constraints we have investigated. We evaluate our algorithm by applying it to a representative problem in the printed electronics field.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
具有子路径约束的进化路径规划
我们开发了一种受子路径约束的规划路径的进化方法。这些约束可以包括必须并入解路径的子路径、路径交叉限制和避障。我们的方法包括两个阶段。在第一阶段,在不考虑任何障碍的情况下找到一个全球性的解决办法。在第二阶段,进行局部规划以修改全局路径以避开障碍物。第一阶段涉及利用现有算子和新的子路径反转算子的遗传算法的固定长度染色体公式。第二阶段涉及图形搜索过程。我们的算法适用于印刷电子领域,其中连续喷涂过程用于将电气功能材料沉积到柔性基板上。这些过程产生了我们已经研究过的各种子路径约束。我们通过应用于印刷电子领域的一个代表性问题来评估我们的算法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Board-Level Vibration Failure Criteria for Printed Circuit Assemblies: An Experimental Approach Editorial - CPMT Society to Merge Transactions in 2011 An Integrated Manufacturing System for the Design, Fabrication, and Measurement of Ultra-Precision Freeform Optics Signal Integrity Enhanced EBG Structure With a Ground Reinforced Trace Reducing Solder Paste Inspection in Surface-Mount Assembly Through Mahalanobis–Taguchi Analysis
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1