Expanding Film and Process for High Efficiency 5 Sides Protection and FO-WLP Fabrication

Abstract

The novel expanding film and the process have been developed for the fabrication of 5 sides protection of die and fan out wafer level package. This can skip the time-consuming die-replacement process for die gap widening. The process consists of the steps of expanding of diced-wafer on the film, transferring the dice to the carrier, over-molding and mold dicing. Every die edge protection by molding compound and the singulation was demonstrated. The die gap was able to be controlled from 0.5 mm to 3.5 mm. In the case of 1.5 mm die gap, the standard deviation was about 0.05 mm. It was also indicated that the film could be applied for 1 mm × 1 mm, 5 mm × 5 mm and 10 mm × 10 mm size dice.