Fabriciton of High Strength NiCo Alloy and Rh Coating Using Electroplating Method

Yong-soo Lee, Seo-Hyang Lee, Jae-Ho Lee
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Abstract

NiCo alloys are electroplated in sulfate bath. The concentration of cobalt sulfate and current density were varied to optimize the surface hardness. The properties of NiCo deposits were analyzed using field emission scanning electron microscopy (FESEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD). The surface hardness of the NiCo alloy was increased up to 500Hv at 24 w% Co in the deposits due to the grain refinement. The size of grain was reduced to 12 nm. The residual stress of the deposits was varied from tensile to compressive as the saccharine concentration increased. The zero residual stress was achieved at 0.05 g/L saccharine addition. The electrodeposition of rhodium (Rh) on silicon substrate at different current conditions were investigated. The cracks were found at high current density during the direct current (DC) plating. The pulse current (PC) plating were applied to avoid the formation of cracks on the deposits. Off time in the pulse plating relieved the residual stress of the Rh deposits and consequently the current conditions for the crack-free Rh deposits were obtained. Optimum pulse current (PC) condition is 5:5 (on:off) for the crack-free Rh electroplating.
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电镀法制备高强度NiCo合金及Rh涂层
镍基合金在硫酸盐浴中电镀。通过改变硫酸钴浓度和电流密度来优化表面硬度。采用场发射扫描电镜(FESEM)、能谱仪(EDS)和x射线衍射仪(XRD)分析了NiCo镀层的性能。当Co含量为24%时,镍基合金的表面硬度可提高到500Hv。晶粒尺寸减小到12 nm。随着糖精浓度的增加,沉积层的残余应力由拉向压变化。添加0.05 g/L的糖精可使残余应力为零。研究了不同电流条件下硅衬底上铑(Rh)的电沉积。在直流电镀过程中,在高电流密度下发现了裂纹。采用脉冲电流(PC)电镀,避免了镀层上裂纹的形成。脉冲镀的关闭时间减轻了Rh镀层的残余应力,从而获得了无裂纹Rh镀层的当前条件。无裂纹Rh电镀的最佳脉冲电流(PC)条件为5:5(开:关)。
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