Design and Performance Analysis of Application Specific Integrated Circuit for Internet of Things Applications

Vivek Pogra, Amandeep Singh, S. Vishvakarma, B. Raj
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Abstract

This paper proposes a novel design of application specific integrated circuit (ASIC) which is capable of connecting sensor network and other electronic systems to the internet. The transfer of data between different networks and electronic systems is controlled by internet of things (IoT) platform with the help of instruction sent to ASIC. ASIC will act as serial peripheral interface (SPI) master to all connected networks and data will be transferred serially between them. The different ASIC modules are SPI module, control module, memory module and data/instruction decoder with additional modules built-in self-test (BIST) and direct memory access (DMA). The proposed ASIC will consume less power as compared to conventional microcontroller/microprocessor due to SPI feature along with DMA on ASIC for IoT applications. It is described in very high speed integrated circuit hardware description language (VHDL) at register transfer level (RTL) and simulation is done on the Vivado 2016.2.
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面向物联网应用的专用集成电路设计与性能分析
本文提出了一种新型的专用集成电路(ASIC),它能够将传感器网络和其他电子系统连接到互联网。不同网络和电子系统之间的数据传输由物联网(IoT)平台通过向ASIC发送指令来控制。ASIC将作为所有连接网络的串行外设接口(SPI)主机,数据将在它们之间串行传输。不同的ASIC模块是SPI模块,控制模块,内存模块和数据/指令解码器与附加模块内置自检(BIST)和直接内存访问(DMA)。由于SPI功能以及用于物联网应用的ASIC上的DMA,与传统的微控制器/微处理器相比,拟议的ASIC将消耗更少的功耗。在寄存器传输级(RTL)用超高速集成电路硬件描述语言(VHDL)进行描述,并在Vivado 2016.2上进行仿真。
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来源期刊
Sensor Letters
Sensor Letters 工程技术-电化学
自引率
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审稿时长
6 months
期刊介绍: The growing interest and activity in the field of sensor technologies requires a forum for rapid dissemination of important results: Sensor Letters is that forum. Sensor Letters offers scientists, engineers and medical experts timely, peer-reviewed research on sensor science and technology of the highest quality. Sensor Letters publish original rapid communications, full papers and timely state-of-the-art reviews encompassing the fundamental and applied research on sensor science and technology in all fields of science, engineering, and medicine. Highest priority will be given to short communications reporting important new scientific and technological findings.
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