Ming-Hung Chen, Tzu-Hsing Chiang, Jia-Hao Zhang, Hsu-Chiang Shih, Sheng-Chi Hsieh, T. Lee, C. Hung
{"title":"Panel-Based Integrated Passive Device for RF Applicatio","authors":"Ming-Hung Chen, Tzu-Hsing Chiang, Jia-Hao Zhang, Hsu-Chiang Shih, Sheng-Chi Hsieh, T. Lee, C. Hung","doi":"10.1109/ECTC.2017.256","DOIUrl":null,"url":null,"abstract":"In this paper, a mass production solution of integrated passive device utilized on radio frequency communication systems was proposed through a glass panel platform where the size could be up to 408 mm * 512 mm and provided 1-layer capacitor and 1-layer inductor for IPD design. The structure characterization of panel-based IPD was performed as well as the electrical stability and RF functional test were evaluated to show the capability reference for further applications. The panel-based process could also provide a cost effective solution on emerging production.","PeriodicalId":6557,"journal":{"name":"2017 IEEE 67th Electronic Components and Technology Conference (ECTC)","volume":"13 1","pages":"185-189"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE 67th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2017.256","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
In this paper, a mass production solution of integrated passive device utilized on radio frequency communication systems was proposed through a glass panel platform where the size could be up to 408 mm * 512 mm and provided 1-layer capacitor and 1-layer inductor for IPD design. The structure characterization of panel-based IPD was performed as well as the electrical stability and RF functional test were evaluated to show the capability reference for further applications. The panel-based process could also provide a cost effective solution on emerging production.
本文提出了一种用于射频通信系统的集成无源器件的量产解决方案,该方案通过尺寸可达408 mm * 512 mm的玻璃面板平台,为IPD设计提供1层电容和1层电感。对基于面板的IPD进行了结构表征,并进行了电稳定性和射频功能测试,为进一步应用提供了性能参考。基于面板的工艺也可以为新兴生产提供具有成本效益的解决方案。