Panel-Based Integrated Passive Device for RF Applicatio

Ming-Hung Chen, Tzu-Hsing Chiang, Jia-Hao Zhang, Hsu-Chiang Shih, Sheng-Chi Hsieh, T. Lee, C. Hung
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引用次数: 2

Abstract

In this paper, a mass production solution of integrated passive device utilized on radio frequency communication systems was proposed through a glass panel platform where the size could be up to 408 mm * 512 mm and provided 1-layer capacitor and 1-layer inductor for IPD design. The structure characterization of panel-based IPD was performed as well as the electrical stability and RF functional test were evaluated to show the capability reference for further applications. The panel-based process could also provide a cost effective solution on emerging production.
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基于面板的射频集成无源器件
本文提出了一种用于射频通信系统的集成无源器件的量产解决方案,该方案通过尺寸可达408 mm * 512 mm的玻璃面板平台,为IPD设计提供1层电容和1层电感。对基于面板的IPD进行了结构表征,并进行了电稳定性和射频功能测试,为进一步应用提供了性能参考。基于面板的工艺也可以为新兴生产提供具有成本效益的解决方案。
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