Harnessing fabrication process signature for predicting yield across designs

Abstract

Yield estimation is an indispensable piece of information at the onset of high-volume manufacturing (HVM) of a device. The increasing demand for faster time-to-market and for designs with growing quality requirements and complexity, requires a quick and successful yield estimation prior to HVM. Prior to commencing HVM, a few early silicon wafers are typically produced and subjected to thorough characterization. One of the objectives of such characterization is yield estimation with better accuracy than what pre-silicon Monte Carlo simulation may offer. In this work, we propose predicting yield of a device using information from a similar previous-generation device, which is manufactured in the same technology node and in the same fabrication facility. For this purpose, we rely on the Bayesian Model Fusion (BMF) technique. The effectiveness of the proposed methodology is evaluated using sizable industrial data from two RF devices in a 65nm technology.