Study of Package-on-Package solder joints under random vibration load based on Patran

Abstract

The 3D finite element analysis model of Package-on-Package solder joints was set up based on Patran software. The natural frequency, vibration mode of the model was analyzed under the condition of random vibration, the stress and strain distribution and the strain power spectrum density of response curves of the Package-on-Package solder joints were obtained, and the random vibration fatigue life of the Package-on-Package solder joints were also calculated out based on the power spectrum and rain flow count method; the influence of pad diameter on the random vibration fatigue life of the Package-on-Package solder joints were analyzed. The results show that the Package-on-Package solder joints of the model in this paper has the random vibration fatigue life of 997 hours; on the condition of the pad diameter of the second-layer solder joints increases from 0.15 mm to 0.30mm, the Package-on-Package solder joints vibration fatigue life increases with the increase of the pad diameter.