Applying novel non-destructive failure analysis techniques on the package related failures

Abstract

Recently, lots R&D efforts are put on the 2.5D and 3D IC to make package smaller, thinner and with enhanced performance and functions. The complexity of the packaging structure makes the failure analysis a difficulty. When chip function is recovered back after decapsulation of the package. Technique and tools are required to catch the failure site before opening the package. In order to detailed investigate the root cause at packaging level, new tools with higher resolution and penetration capability are required to non-destructively tackle the failure. By utilizing TDR, 3D X-ray microscope and lock-in thermal emission microscope, failure site resulted from package process can be clearly revealed and the root cause can be identified by following physical failure analysis such as cross sectional FIB, SEM and TEM. Examples of failure cases will be discussed in this paper.